Intel E7500, Thermal Design Manual

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Packaging Technology
R
12 Intel
®
E7500/E7505 Chipset MCH Thermal Design Guide
Figure 3. MCH Package Dimensions (Top View)
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
E
C
B
A
10 16 20
3 5 7 9
11 13 15
19
4 6 18 8 12 14 22
21
24 23 26
25
28
27
30 29
31
32
(n)x 0.025 Min
Metal Edge
(n)x
∅
0.790 ± 0.025
Solder Resist Opening
(n)x 0.650 ± 0.040
Detail A
∅ ∅ ∅ ∅ 00.071 L C
∅ ∅ ∅ ∅ 00.200 L C A S B
33
1
2
1.270
20.320
40.640
2x 42.500 ±0.100
0.200 A B
1.270
21.250
Detail A
MCH_Pkg_TopView
17
NOTES:
1. All dimensions are in millimeters.
2. All dimensions and tolerances conform to ANSI Y14.5M–1982.