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Introduction and Features Summary
Intel
®
Core
TM
i7-660UE, i7-620LE/UE, i7-610E, i5-520E, i3-330E and Intel
®
Celeron
®
Processor P4505, U3405 Series
Datasheet Addendum
August 2010
8
Document Number: 323178-003
1
Introduction and Features
Summary
1.1
Introduction
This Datasheet Addendum is a supplement to the Intel® Core
TM
i7-600, i5-500 and i3-
300 Mobile Processor Series Datasheet. It contains the additional DC and AC electrical
specifications, signal integrity, differential signaling specifications, pinout and signal
definitions, interface functional descriptions, additional feature information and
configuration registers pertinent to the implementation and operation of the Intel
®
Core
TM
i7-660UE, i7-620LE/UE, i7-610E, i5-520E, i3-330E and Intel
®
Celeron
®
Processor P4505, U3405 Series on its respective platform.
Intel
®
Core
TM
i7-660UE, i7-620LE/UE, i7-610E, i5-520E, i3-330E and Intel
®
Celeron
®
Processor P4505, U3405 Series is the next generation of 64-bit, multi-core mobile
processor built on a 32- nanometer process technology. Throughout this document,
Intel
®
Core
TM
i7-660UE, i7-620LE/UE, i7-610E, i5-520E, i3-330E and Intel
®
Celeron
®
Processor P4505, U3405 Series may be referred to as simply the processor. The
processor is designed for a two-chip platform as opposed to the traditional three-chip
platforms (processor, GMCH, and ICH). The two-chip platform consists of a processor
and the Platform Controller Hub (PCH) and enables higher performance, lower cost,
easier validation, and improved x-y footprint. The PCH may also be referred to as
Mobile Intel® 5 Series Chipset (formerly Ibex Peak-M). Intel
®
Core
TM
i7-660UE, i7-
620LE/UE, i7-610E, i5-520E, i3-330E and Intel
®
Celeron
®
Processor P4505, U3405
Series is designed for the Intel
®
Core
TM
i7 processor based low-power platform and is
offered in a BGA1288 package.
Included in this family of processors is an integrated graphics and memory controller
die on the same package as the processor core die. This two-chip solution of a
processor core die with an integrated graphics and memory controller die is known as a
multi-chip package (MCP) processor.
Note:
Integrated graphics and memory controller die is built on 45-nanometer process
technology.