3rd Generation Intel
®
Core
™
i7-3770, Intel
®
Core
™
i5-3550S, and Intel
®
Core
™
i3-3220 Processor-based
Platforms for Intelligent Systems
Ideal for Intelligent Systems—context-aware, securely managed embedded devices that connect seamlessly
to networks, clouds and each other.
Product Overview
Manufactured on industry-leading 22nm
process technology with 3D Tri-Gate tran-
sistors, these 3rd generation Intel® Core™
processors offer superior performance,
enhanced media and graphics capabilities
and flexibility, making them ideal for a wide
range of intelligent systems including retail
transaction terminals, digital signage, digital
security and surveillance, gaming platforms,
industrial automation and medical equip-
ment. As with the 2nd generation Intel®
Core™ processor family, full integration of
the CPU, media/graphics capabilities and
memory controller reduces overall platform
footprint and saves on-board real estate.
When paired with the Intel® B75 and Intel®
Q77 Express chipsets, these processors
offer fast connectivity with integrated
next-generation I/O technologies such as
USB 3.0. The platform includes Intel® Rapid
Start Technology
1
for increased system
responsiveness and support for DDR3L
memory to improve power efficiency.
Additionally, the Intel® Core™ i3-3220
processor can be paired with the Intel®
C216 chipset to enable Error Correcting
Code (ECC) capabilities.
Next-generation graphics engines
significantly improve graphics and media
performance compared to 2nd generation
Intel Core processor-based platforms. This
platform supports three independent
displays, enabling one system to deliver
multiple displays without the need for
a discrete graphics card. Built-in visual
features, including Intel® Clear Video HD
technology and Intel® Quick Sync Video,
mean smoother visual quality, improved
ability to decode and transcode simulta-
neous video streams, and spectacular HD
media playback. Additionally, the platform
supports next-generation graphics APIs,
such as Microsoft DirectX* 11.
Processors offer quad- and dual-core
capabilities with industry-leading perfor-
mance and thermal design power (TDP)
options of 55W to 77W. While incorporat-
ing advanced technology, they remain
software-compatible with previous
IA-32 processors.
Intel® vPro™ technology,
2
enabled when
processors are paired with the Intel Q77
Express chipset, delivers intelligent secu-
rity, expanded management capabilities
and improved power management. The
technology supports operating system-
absent manageability and down-the-wire
security even when the system is powered
off, the operating system is unresponsive,
or software agents are disabled.
This 3rd generation Intel Core processor
family and Intel® 7 Series chipsets are
pin and package compatible with the 2nd
generation Intel Core processor family
and Intel® 6 Series chipsets, allowing
developers to mix and match processors
and chipsets to better suit their design
needs. Developers can create one board
design and scale a product line, using the
same sockets to help cut design costs and
accelerate time-to-market.
PlatfOrm brief
intel® Core™ Processors with intel® b75 express,
intel® Q77 express, and intel® C216 Chipsets
Intelligent Systems
