Intel BX80619I73820, Design Manual, Page: 12 / 124

Introduction
12 Thermal/Mechanical Specifications and Design Guide
1.1 References
Material and concepts available in the following documents may be beneficial when
reading this document.
1.2 Definition of Terms
Table 1-1. Reference Documents
Document Location
Intel ® Core™ i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 1 326196
Intel
®
Core™ i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 2 326197
Intel ® Core™ i7 Processor Family for the LGA-2011 Socket Specification Update 326198
Entry-level Electronics Bay Specification Available at http://
ssiforum.oaktree.com/
European Blue Angel Recycling Standards http://www.blauer-
engel.de
Table 1-2. Terms and Descriptions (Sheet 1 of 2)
Term Description
Bypass
Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
DTS
Digital Thermal Sensor reports a relative die temperature as an offset from TCC
activation temperature.
MSR
The processor provides a variety of model specific registers that are used to control and
report on processor performance. Virtually all MSRs handle system related functions and
are not accessible to an application program.
FSC Fan Speed Control
IHS
Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
Square ILM
Independent Loading Mechanism provides the force needed to seat the 2011-LGA
package onto the socket contacts and has 80 × 80 mm heatsink mounting hole pattern.
The Customer Reference Board will use this layout. The enabled Thermal solutions are
only compatible with this ILM.
LGA2011-0 socket
The processor mates with the system board through this surface mount, 2011-contact
socket for the platform.
PECI
The Platform Environment Control Interface (PECI) is a one-wire interface that provides
a communication channel between Intel processor and chipset components to external
monitoring devices.
Ψ
CA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
CASE
– T
LA
) / Total
Package Power. Heat source should always be specified for
Ψ
measurements.
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
CASE
– T
S
) / Total
Package Power.
Ψ
SA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
S
– T
LA
) / Total Package Power.
T
CASE
The case temperature of the processor measured at the geometric center of the topside
of the IHS.
T
CASE
_
MAX
The maximum case temperature as specified in a component specification.
TCC
Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature
by using clock modulation and/or operating frequency and input voltage adjustment
when the die temperature is very near its operating limits.