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Document Number: 424077 Revision: 2.0Thermal/Mechanical Specifications and Design Guidelines
43
Thermal Specifications
Notes:
1.
The ambient temperature is measured at the inlet to the processor thermal solution.
2.
This column can be expressed as a function of T
AMBIENT
by the following equation:
Ψ
CA
= 0.29 + (45.2 - T
AMBIENT
) x 0.0353
3.
This column can be expressed as a function of T
AMBIENT
by the following equation:
Ψ
CA
= 0.289 + (45.2 - T
AMBIENT
) x 0.0222
Table 6-5.
Thermal Solution Performance above T
CONTROL
for the Intel
®
Xeon
®
Processor
3400 Series (45W)
T
AMBIENT
1
Ψ
CA
at
DTS = T
CONTROL
2
Ψ
CA
at
DTS = -1
3
45.2
0.290
0.289
44.0
0.332
0.316
43.0
0.368
0.338
42.0
0.403
0.360
41.0
0.438
0.382
40.0
0.473
0.404
39.0
0.509
0.427
38.0
0.544
0.449
37.0
0.579
0.471
36.0
0.615
0.493
35.0
0.650
0.516
34.0
0.685
0.538
33.0
0.720
0.560
32.0
0.756
0.582
31.0
0.791
0.604
30.0
0.826
0.627
29.0
0.861
0.649
28.0
0.897
0.671
27.0
0.932
0.693
26.0
0.967
0.716
25.0
1.003
0.738
24.0
1.038
0.760
23.0
1.073
0.782
22.0
1.108
0.804
21.0
1.114
0.827
20.0
1.179
0.849
Summary of Contents for BX80605X3440 - Quad Core Xeon X3440
Page 10: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 26: ...LGA1156 Socket 28 Thermal Mechanical Specifications and Design Guidelines...
Page 78: ...Component Suppliers 78...
Page 80: ...Mechanical Drawings 80 Figure B 1 Socket Heatsink ILM Keepout Zone Primary Side for 1U Top...
Page 87: ...87 Mechanical Drawings Figure B 8 Heatsink Compression Spring...
Page 88: ...Mechanical Drawings 88 Figure B 9 Heatsink Load Cup...
Page 89: ...89 Mechanical Drawings Figure B 10 Heatsink Retaining Ring...
Page 91: ...91 Mechanical Drawings Figure B 12 Heatsink Backplate...
Page 92: ...Mechanical Drawings 92 Figure B 13 Heatsink Backplate Insulator...
Page 102: ...Socket Mechanical Drawings 104 Thermal Mechanical Specifications and Design Guidelines...
Page 106: ...Package Mechanical Drawings 108 Thermal Mechanical Specifications and Design Guidelines...