Socket Mechanical Drawings
102
Thermal/Mechanical Specifications and Design Guidelines
(
Figure C-3. Socket Mechanical Drawing (Sheet 3 of 4)
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8 7 6 5
4 3 2
8 7 6 5
4 3 2
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39X
0.9144
40X ROWS
29X
0.9144
30X COLUMNS
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0.9144
40 ROWS
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0.75
17.3738
7.5868
8.2296
(3.1144
)
18.9308
10.0584
18.2878
17.3738
8.2296
(3.1144
)
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18.9308
18.2878
10.0584
0.75
4
THIS DRAWING CONTAINS INTEL CORPORAT
ION CONFIDENTIAL INFORMATION. IT IS
DISCLOSED IN CONFIDENCE AND ITS CONT
ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI
SPLAYED OR MODIFIED, WITHOUT THE PRI
OR WRITTEN CONSENT OF INTEL CORPORAT
ION.
E27147
3
4
DWG. NO
SHT.
REV
DEPARTMENT
R
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
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SIZE
DRAWING NUMBER
REV
A1
E27147
4
SCALE:
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DO NOT SCALE DRAWING
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1156X SOLDER BALLS
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10
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1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
31 33 35 37 39 32 34 36 38 40
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0.25
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TOP VIEW SCALE
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8X 0.4X0.5 CHAMFER (0.4 HORIZONTAL 0.5 VERTICAL)
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DETAIL
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Summary of Contents for BX80605X3440 - Quad Core Xeon X3440
Page 10: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 26: ...LGA1156 Socket 28 Thermal Mechanical Specifications and Design Guidelines...
Page 78: ...Component Suppliers 78...
Page 80: ...Mechanical Drawings 80 Figure B 1 Socket Heatsink ILM Keepout Zone Primary Side for 1U Top...
Page 87: ...87 Mechanical Drawings Figure B 8 Heatsink Compression Spring...
Page 88: ...Mechanical Drawings 88 Figure B 9 Heatsink Load Cup...
Page 89: ...89 Mechanical Drawings Figure B 10 Heatsink Retaining Ring...
Page 91: ...91 Mechanical Drawings Figure B 12 Heatsink Backplate...
Page 92: ...Mechanical Drawings 92 Figure B 13 Heatsink Backplate Insulator...
Page 102: ...Socket Mechanical Drawings 104 Thermal Mechanical Specifications and Design Guidelines...
Page 106: ...Package Mechanical Drawings 108 Thermal Mechanical Specifications and Design Guidelines...