ATX Thermal/Mechanical Design Information
Thermal and Mechanical Design Guidelines
51
6
ATX Thermal/Mechanical
Design Information
6.1
ATX Reference Design Requirements
This chapter will document the requirements for an active air-cooled design, with a fan
installed at the top of the heatsink. The thermal technology required for the processor.
The Intel Core™2 Duo processor E8000, E7000 series, Intel Pentium dual-core
processor E6000, E5000 series, and Intel
®
Celeron
®
processor E3000 series require a
thermal solution equivalent to the E18764-001 reference design; see Figure 6-1 for an
exploded view of this reference design.
Note:
The part number E18764-001 provided in this document is for reference only. The
revision number -001 may be subject to change without notice.
The E18764-001 reference design takes advantage of an acoustic improvement to
reduce the fan speed to show the acoustic advantage (its acoustic results show in the
Table 6–2).
The E18764-001 reference design takes advantage of the cost savings for the several
features of the design including the reduced heatsink height, inserted aluminum core
and the new TIM material (Dow Corning TC-1996 grease), see Figure 6-2. The overall
46 mm height thermal solution supports the unique and smaller desktop PCs including
small and ultra small form factors, down to the 5L size, see uATX SFF Guidance for
additional details on uATX SFF design.
Summary of Contents for AT80569PJ080N - Core 2 Quad 3 GHz Processor
Page 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines...
Page 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines...
Page 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines...
Page 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines...
