Intel AT80569PJ080N - Core 2 Quad 3 GHz Processor, Design Manual

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Introduction
Thermal and Mechanical Design Guidelines 11
1.2 References
Material and concepts available in the following documents may be beneficial when
reading this document.
Material and concepts available in the following documents may be beneficial when
reading this document.
Document Location
Intel
®
Core™2 Duo Processor E8000 and E7000 Series
Datasheet
www.intel.com/design/processor/d
atashts/318732.htm
Intel
®
Pentium
®
Dual-Core Processor E6000 and E5000
Series Datasheet
Intel
® Celeron ® Processor E3000 Series Datasheet
LGA775 Socket Mechanical Design Guide
uATX SFF Design Guidance
http://www.formfactors.org/
Fan Specification for 4-wire PWM Controlled Fans http://www.formfactors.org/
ATX Thermal Design Suggestions http://www.formfactors.org/
microATX Thermal Design Suggestions http://www.formfactors.org/
Balanced Technology Extended (BTX) System Design
Guide http://www.formfactors.org/
Thermally Advantaged Chassis Design Guide http://www.intel.com/go/chassis/
1.3 Definition of Terms
Term Description
T
A
The measured ambient temperature locally surrounding the processor. The
ambient temperature should be measured just upstream of a passive heatsink
or at the fan inlet for an active heatsink.
T
C
The case temperature of the processor, measured at the geometric center of
the topside of the IHS.
T
E
The ambient air temperature external to a system chassis. This temperature
is usually measured at the chassis air inlets.
T
S
Heatsink temperature measured on the underside of the heatsink base, at a
location corresponding to
T
C
.
T
C-MAX
The maximum case temperature as specified in a component specification.
Ψ
CA
Case-to-ambient thermal characterization parameter (psi). A measure of
thermal solution performance using total package power. This is defined as:
(T
C
– T
A
) / Total Package Power.
Note: Heat source must be specified for
Ψ
measurements.