Thermal Metrology
R
14
Intel
®
848P Chipset Thermal Design Guide
Figure 2. Zero-Degree Angle Attach Methodology
angle_attach_1
Thermocouple Wire
Die
Thermocouple Bead
Substrate
Top View, Not to Scale
Figure 3. Zero-Degree Angle Attach Heatsink Modifications
Angle_Attach_Heatsink_Mod
1.3 mm (0.05 in.)
(0.5 mm (0.02 in.) Depth)
3.3 mm (0.13 in.) Diameter
(1.5 mm (0.06 in.) Depth)
Generic Heatsink Shown, Not to Scale
