January 2007
263
Intel
®
855GME Chipset and Intel
®
6300ESB ICH Embedded Platform Design Guide
Platform Clock Routing Guidelines
11.2.9.2
SRC General Routing Guidelines
•
When routing the 100 MHz differential clocks, do not split up the two halves of a differential
clock pair between layers. Route to all agents on the same physical routing layer referenced to
ground.
•
If a layer transition is required, make sure skew induced by the vias used to transition between
routing layers is compensated in the traces to other agents.
•
Do not place vias between adjacent complementary clock traces, and avoid differential vias.
Vias placed in one half of a differential pair must be matched by a via in the other half.
Differential vias may be placed within length L1, between clock driver and Rs, if needed to
shorten length L1.
Summary of Contents for 6300ESB ICH
Page 24: ...24 Intel 855GME Chipset and Intel 6300ESB ICH Embedded Platform Design Guide Introduction...
Page 102: ...102 Intel 855GME Chipset and Intel 6300ESB ICH Embedded Platform Design Guide...
Page 122: ...122 Intel 855GME Chipset and Intel 6300ESB ICH Embedded Platform Design Guide...
Page 190: ...190 Intel 855GME Chipset and Intel 6300ESB ICH Embedded Platform Design Guide Hub Interface...
Page 318: ...318 Intel 855GME Chipset and Intel 6300ESB ICH Embedded Platform Design Guide Layout Checklist...