Intel 6300ESB ICH, Design Manual

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Intel
®
855GME Chipset and Intel
®
6300ESB ICH Embedded Platform Design Guide
System Memory Design Guidelines (DDR-SDRAM)
5.4.4.5 SDQ/SDQS Signal Package Lengths
The package length data in Table 34 shall be used to tune the length of each SDQ, SDM, and SDQS
motherboard trace as required to achieve the overall length matching requirements defined in the
prior sections.
Figure 68. SDQ/SDM to SDQS Trace Length Matching Diagram
DIMM0
GMCH Package
Note: All lengths are measured from GMCH die
pad to DIMM connector pad.
SDQ[0]
SDQ[1]
SDQ[2]
SDQ[3]
SDQS[0]
SDQ[4]
SDQ[5]
SDQ[6]
SDQ[7]
SDQ Length (Y) = (X ±25 mils)
SDQ Length (Y) = (X ±25 mils)
SDQS Length = X
DIMM0 DIMM1
GMCH Package
SDQ[0]
SDQ[1]
SDQ[2]
SDQ[3]
SDQS[0]
SDQ[4]
SDQ[5]
SDQ[6]
SDQ[7]
SDQ Length (Y) =
(X +/-25 mils)
SDQ Length (Y) =
(X +/-25 mils)
SDQS Length =
X
Note: All lengths are measured from GMCH die-
pad to DIMM connector pads.
855GME
Die
855GME
Die
SDM[0]
SDM Length (Y) = (X ±25 mils)
SDM Length (Y) =
(X ±25 mils)
SDM[0]
Note: Only one byte lane is shown for
reference. Each byte lane is matched
iIndependently.