Heat Sink Back Plate Drawings
132
Thermal/Mechanical Specifications and Design Guidelines
Figure E-1. Heat Sink Back Plate Keep In Zone
2X 75
2X 75
38.12
78.25
19.19
27.81
95
95
13.9
34.21
5.08
2.54
72.75
2X 37.54
26 MAX
26 MAX
2X 25.81
35.22
36
3X
5
4X
9.25
B
A
B
C
C
DEPARTMENT
R
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
-
TITLE
LGA 1156 & 1155 HS BACKPLATE KEEP IN
SIZE
DRAWING NUMBER
REV
A1
E58389_REV_B_PAE
B
SCALE:
2
DO NOT SCALE DRAWING
SHEET
1
OF
1
NOTES:
1
SOCKET CENTER PLANES ARE REFERENCED FROM GEOMETRIC
CENTER OF SOCKET HOUSING CAVITY FOR CPU PACKAGE (ALIGNS WITH DATUM REFERENCE GIVEN FOR BOARD COMPONENT KEEP-INS). 3. LGA 1156 & 1155 HS BACKPLATE KEEP-IN VOLUME ENCOMPASS THE BACKPLATE NOMINAL VOLUME AND ALLOWANCES FOR SIZE TOLERANCES. THERMAL/MECHANICAL COMPONENT
DEVELOPERS SHALL DESIGN TO THE OUTSIDE OF SOCKET H1 ILM BACKPLATE
4
WITH CLEARANCE MARGINS. REFERENCE DRAWINGS: E20847 - LGA 1156 & 1155 ILM BACKPLATE E21320 - LGA 1156 & 1155 ILM
& PROCESSOR KEEPIN
4
OUTLINE OF LGA 1156 & 1155 ILM BACKPLATE FOR REFERENCE ONLY.
5. DIMENSIONS ARE IN MILLIMETERS
1
1
1
1
4
4
Summary of Contents for 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL S AND DESIGN GUIDELINES 01-2011
Page 12: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 36: ...Independent Loading Mechanism ILM 36 Thermal Mechanical Specifications and Design Guidelines...
Page 62: ...PECI Interface 62 Thermal Mechanical Specifications and Design Guidelines...
Page 88: ...ATX Reference Thermal Solution 88 Thermal Mechanical Specifications and Design Guidelines...
Page 102: ...Boxed Processor Specifications 102 Thermal Mechanical Specifications and Design Guidelines...
Page 120: ...Mechanical Drawings 120 Thermal Mechanical Specifications and Design Guidelines...
Page 126: ...Socket Mechanical Drawings 126 Thermal Mechanical Specifications and Design Guidelines...
Page 130: ...Package Mechanical Drawings 130 Thermal Mechanical Specifications and Design Guidelines...
