User Manual
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V 1.0
2021-08-25
XDPP1100 technical reference manual
Digital power controller
Telemetry sense
Figure 33
TS input sequencing
4.3
Telemetry sense current DAC
The telemetry sense current DAC (TS IDAC) is connected to either the XADDR1, XADDR2 or IMON pin to develop a
voltage across resistors connected between pin and GND, as was shown in
. The selection of the pin
connection is controlled by the TS processor (TSP).
The TS IDAC has the following specifications:
•
6-bit current output DAC
•
LSB = 10 µA
•
Range = 0 to 630 µA
When it is used for current sharing, additional resolution (up to 10 bits total) is created through dithering. It also
requires a capacitor in parallel to the resistor from IMON to GND.
4.4
Telemetry sense processor
The TSP is shown in
, and it consists of the following submodules:
•
TS sequencer
•
Gain/offset correction
•
V
IN
computation
•
Internal temperature computation
•
X-valent measurement
These TSP submodules are described in detail in the following subsections.
ts_muxctrl1
ts_muxctrl2
clk_25mhz
clk_tsadc
sample
soc
eoc
ts_adc[9:0]
prisen_adc[13:0]
prisen_update
vin
0 (ITSEN)
1 (PRISEN)
7 (MUX1)
6 (XADDR2)
sample
PRISEN
sample
ITSEN
convert PRISEN
PRISEN ADC output
ATSEN ADC output (mux_mode=7)
Current PRISEN ADC output
Previous PRISEN ADC output
Current V
IN
computation
Previous V
IN
computation
