XC886/888CLM
Introduction
User’s Manual
1-17
V1.3, 2010-02
Introduction, V 1.1
1.4
Chip Identification Number
Each device variant of XC886/888 is assigned an unique chip identification number to
allow easy identification of one device variant from the others. The differentiation is
based on the product, variant type and device step information.
Two methods are provided to read a device variant’s chip identification number:
•
In-application subroutine, see
•
Bootstrap loader (BSL) mode A, see
V
DDP
7, 17, 43/
7, 25, 55
–
–
I/O Port Supply (3.3 or 5.0 V)
Also used by EVR and analog modules. All
pins must be connected.
V
SSP
18, 42/26, 54
–
–
I/O Ground
All pins must be connected.
V
DDC
6/6
–
–
Core Supply Monitor (2.5 V)
V
SSC
5/5
–
–
Core Supply Ground
V
AREF
24/32
–
–
ADC Reference Voltage
V
AGND
23/31
–
–
ADC Reference Ground
XTAL1
4/4
I
Hi-Z
External Oscillator Input
(backup for on-chip OSC, normally NC)
XTAL2
3/3
O
Hi-Z
External Oscillator Output
(backup for on-chip OSC, normally NC)
TMS
10/16
I
PD
Test Mode Select
RESET
41/53
I
PU
Reset Input
MBC
1)
44/58
I
PU
Monitor & BootStrap Loader Control
NC
–/56, 57
–
–
No Connection
1) An external pull-up device in the range of 4.7 k
Ω
to 100 k
Ω
is required to enter user mode. Alternatively MBC
can be tied to high if alternate functions (for debugging) of the pin are not utilized.
Table 1-3
Pin Definitions and Functions
(cont’d)
Symbol Pin Number
(TQFP-48/64)
Type Reset
State
Function
*