IEI Technology WAFER-ULT3, User Manual

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WAFER-ULT3/ULT4 3.5" SBC
Page 60
4.7 Motherboard Installation
4.7.1 Heat Spreader
WARNING:
The heat spreader installed on the WAFER-ULT3/ULT4 can only serve as a
heat conductor which needs additional heat dissipation mechanism to achieve
suitable thermal condition. DO NOT put the WAFER-ULT3/ULT4 with the heat
spreader directly on a surface that cannot dissipate system heat, and never run
the WAFER-ULT3/ULT4 without the heat spreader secured to the board.
When the WAFER-ULT3/ULT4 is shipped, it is secured to a heat spreader with five
retention screws. The heat spreader must have a direct contact with a heat dissipation
surface to ensure stable operation. In addition, a thin layer of thermal paste has to be
applied onto the heat dissipation surface where it contacts the heat spreader. The
following diagrams show an example of a heat sink module and how it can be installed for
dissipating the heat generated from the motherboard:
Heat sink module:
Material:
Aluminum
Size: 146 mm x 102 mm x 14.6 mm