IEI Technology WAFER-ULT3, User Manual

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WAFER-ULT3/ULT4 3.5" SBC
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DIMM Dual Inline Memory Modules are a type of RAM that offer a 64-bit data
bus and have separate electrical contacts on each side of the module.
DIO The digital inputs and digital outputs are general control signals that
control the on/off circuit of external devices or TTL devices. Data can be
read or written to the selected address to enable the DIO functions.
EHCI The Enhanced Host Controller Interface (EHCI) specification is a
register-level interface description for USB 2.0 Host Controllers.
EIDE Enhanced IDE (EIDE) is a newer IDE interface standard that has data
transfer rates between 4.0 MBps and 16.6 MBps.
EIST Enhanced Intel® SpeedStep Technology (EIST) allows users to modify
the power consumption levels and processor performance through
application software. The application software changes the bus-to-core
frequency ratio and the processor core voltage.
FSB The Front Side Bus (FSB) is the bi-directional communication channel
between the processor and the Northbridge chipset.
GbE Gigabit Ethernet (GbE) is an Ethernet version that transfers data at 1.0
Gbps and complies with the IEEE 802.3-2005 standard.
GPIO General purpose input
HDD Hard disk drive (HDD) is a type of magnetic, non-volatile computer
storage device that stores digitally encoded data.
ICH The Input/Output Control Hub (ICH) is an Intel® Southbridge chipset.
IrDA Infrared Data Association (IrDA) specify infrared data transmission
protocols used to enable electronic devices to wirelessly communicate
with each other.
L1 Cache The Level 1 Cache (L1 Cache) is a small memory cache built into the
system processor.
L2 Cache The Level 2 Cache (L2 Cache) is an external processor memory cache.
LCD Liquid crystal display (LCD) is a flat, low-power display device that
consists of two polarizing plates with a liquid crystal panel in between.