IEI Technology WAFER-TGL-U, User Manual

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WAFER-TGL-U SBC
Page 51
Step 2:
Update the BIOS and ME firmware, and then turn off the system power.
Step 3:
Remove the metal clip on the Flash Descriptor Security Override jumper to its
default setting.
Step 4:
Restart the system. The system will reboot 2 ~ 3 times to complete the ME
firmware update.
Step 0:
4.6 Chassis Installation
4.6.1 Heat Spreader
WARNING:
The heat spreader installed on the WAFER-TGL-U can only serve as a heat
conductor, which needs additional heat dissipation mechanism to achieve
suitable thermal condition. DO NOT put the WAFER-TGL-U with the heat
spreader directly on a surface that cannot dissipate system heat, and never run
the WAFER-TGL-U without the heat spreader secured to the board.
When the WAFER-TGL-U is shipped, it is secured to a heat spreader with five retention
screws. The heat spreader must have a direct contact with a heat dissipation surface to
ensure stable operation. In addition, a thin layer of thermal paste has to be applied onto
the heat dissipation surface where it contacts the heat spreader. The following diagrams
show an example of a heat sink module and how it can be installed for dissipating the heat
generated from the motherboard:
Heat sink module:
Material: Aluminum
Size: 146 mm x 102 mm x 14.6 mm