IEI Technology WAFER-TGL-U, User Manual

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WAFER-TGL-U SBC
Page 3
1.2 Model Variations
The model variations of the WAFER-TGL-U series are listed below.
Model No. SoC
WAFER-TGL-U-i7
Intel® Core™ i7-1185G7E on-board SoC
(1.8 GHz, quad-core, 12 MB cache, TDP=15 W)
WAFER-TGL-U-i5
Intel® Core™ i5-1145G7E on-board SoC
(1.5 GHz, quad-core, 8 MB cache, TDP=15 W)
WAFER-TGL-U-i3
Intel® Core™ i3-1115G4E on-board SoC
(2.2 GHz, dual-core, 6 MB cache, TDP=15 W)
WAFER-TGL-U-C
Intel® Celeron® 6305 on-board SoC
(1.8 GHz, dual-core, 4 MB cache, TDP=15 W)
WAFER-TGL-U-CE
Intel® Celeron® 6305E on-board SoC
(1.8 GHz, dual-core, 4 MB cache, TDP=15 W)
Table 1-1: WAFER-TGL-U Model Variations
1.3 Features
Some of the WAFER-TGL-U motherboard features are listed below:

3.5" SBC with 11 th generation Intel ® ULT processor

Quadruple independent display via dual HDMI, DP and iDPM

One 260-pin 3200 MHz dual-channel DDR4 SO-DIMM slot
(system max. 32 GB)

Easy assembly heat spreader for thermal management

Three RJ-45 Ethernet ports

One M.2 2230 A-key slot for function expansions

One M.2 3052/2242 B-key slot with 5G module support

One SATA 6Gb/s connector with power output

Four USB 3.2 Gen 2 external connectors

One RS-232 connector and two RS-232/422/485 connectors