IEI Technology PCIE-690AM2, User Manual, Page: 51 / 234

PCIE-690AM2 PICMG 1.3 CPU Card
Page 29
Maximum Operating Temperature: 60°C (140°F)
A cooling fan and heat sink must be installed on the CPU. Thermal paste must be
smeared on the lower side of the heat sink before it is mounted on the CPU. Heat sinks
are also mounted on the Northbridge and Southbridge chipsets to ensure the operating
temperature of these chips remain low.
2.9.3 Power Consumption
Table 2-1 shows the power consumption parameters for the PCIE-690AM2 running 3D
Mark® 2001 SE330 with a 2.0GHz AMD Turion 64x2 TL-60 processor and two 1.0GB
667MHz DDR2 DIMMs.
Voltage Current
+3.3V 0.77A
+5.0V 4.23A
+12V 2.53A
5Vsb 0.1A
Table 2-1: Power Consumption
2.10 Expansion Options
2.10.1 Expansion Options Overview
A number of compatible IEI Technology Corp. PICMG 1.3 backplanes and chassis can be
used to develop and expand the system. These backplanes and chassis are listed below.
2.10.2 IEI PICMG 1.3 Backplanes
The backplanes listed in Table 2-2 are compatible with the PCIE-690AM2 and can be
used to develop highly integrated industrial applications. All of the backplanes listed below
have 24-pin ATX connector and a 4-pin ATX connector. For more information about these