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About this Document
3
PEB383 User Manual
July 25, 2011
Integrated Device Technology, Inc.
Confidential - NDA Required
Revision History
October 22, 2009:
Initial publication of PEB383 User Manual.
November 18, 2009:
Updated pinouts for QFN and QFP packages.
December 8, 2009:
Updated pinouts and package drawings for QFN and QFP packages.
December 18, 2009:
Added simulated power numbers to Table 43. Updated Tables 51 and 52 with
simulated Thermal Characteristics values. Updated pinouts and package drawings for QFN and QFP
packages.
January 20, 2010:
In Table 7, changed power numbers for Core, PCIe, and PLL from 1.0V to 1.05V in
the Description column and from 1.2V to 1.05V in the Design Rec. column. In Table 42, changed
power numbers for Core, PCIe, and PLL from 1.2V to 1.05V and also changed minimum and
maximum values for these 3 parameters. In Table 43, changed power numbers for Core, PCIe, and PLL
from 1.0V to 1.05V.
March 29, 2010:
In Table 3, changed pull-up resistor values from 2.4K to 8.2K for Interrupts A, B, C,
and D.
May 5, 2010:
In Table 42, changed TA min and max temperatures to 0 and 70 respectively. In Section
15.3, updated old Table 43 and added new Table 44 for Power Dissipation values.
May 28, 2010:
In Chapter 16, Packaging, updated QFP package drawing. Added new Chapter 17,
Ordering Information.
August 3, 2010:
In Chapter 17, added Tape and Reel to ordering codes.
November 23, 2010:
In Chapter 16, replaced existing QFN package drawing with revised PSC-4327.
January 5, 2011:
In Chapter 13, section 13.7, deleted last bullet containing reference to
TEST_BIDIR_CTRL.
March 7, 2011:
In Chapter 14, changes bit types labeled RE to RWL, added description for RWL in
section 14.1, revised description for bits 0 and 1 in register CLKOUT_ENB_FUNC_DBG, and
changed Reset Value in RID field to 0x01 in register PCI_CLSS. In Chapter 16, section 16.1.2, added
revised 128-pin QFP package drawing.
May 17, 2011:
In Chapter 14, section 14.5.1, added text to the third paragraph that starts with “Note
that...”. Added ZB silicon to Order page in Chapter 17.
May 26, 2011:
In Chapter 15, Table 42, changed maximum ambient temperature from 70 to 85
o
C.
June 21, 2011:
In Chapter 2, Table 3, changed pull-up for PCI_INTA-D pins from 8.2K to 2.4K.
July 25, 2011:
In Chapter 2, Table 3, revised text in Design Recommendation for PCIE_REFCLK pins.