IBM Power 595, Technical Overview And Introduction

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IBM Power 595 Technical Overview and Introduction
Figure 2-3 Power 595 rear view
2.1.2 Center electronic complex (CEC)
The Power 595 CEC is a 20U tall, 24-inch rack-mounted device. It houses the system
processors, memory, redundant system service processors, I/O drawer connection capability,
and associated components. The CEC is installed directly below the power subsystem.
The CEC features a packaging concept based on books. The books contain processors
memory, and connectors to I/O drawers and other servers. These books will hereafter be
referred to as
processor books
. The processor books are located in the CEC, which is
mounted in the primary rack.
Each Processor book assembly contains many components, some of which include:
The processor book planar provides support for four multichip modules (MCM), 32
memory DIMM slots, a connector to the mid-plane, four I/O adapter connectors, two node
controller connectors, and one VPD card connector.
A node power distribution planar provides support for all DCA connectors, memory, and air
temperature sensors.
Bulk Power
Assembly
(BPA)
IO
Drawers
Air Moving
Device-2
(AMD)
Air Moving
Device - 4
(AMD)
Air Moving
Device - 1
(AMD)
Air Moving
Device - 3
(AMD)
Rear View
Bulk Power
Assembly
(BPA)
IO
Drawers
Air Moving
Device-2
(AMD)
Air Moving
Device - 4
(AMD)
Air Moving
Device - 1
(AMD)
Air Moving
Device - 3
(AMD)
Rear View
Air Moving
Device-
(AMD)
Motor Drive
Assembly
MDA