HUAWEI MU736 HSPA+ M.2 Module
Hardware Guide
Electrical and Reliability Features
Issue 05 (2014-01-14)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
63
Item
Test Condition
Standard Sample size Results
Temperature cycle High temperature:
85ºC
Low temperature:
–40ºC
Temperature change
slope: 6ºC/min
Operation mode: no
power
Test duration: 168 h,
336 h, 500 h, 1000 h
for inspection point
JESD22-
A104-C
50
pcs/group
Visual inspection:
ok
Function test: ok
RF specification: ok
Cross section: ok
ESD
HBM (Human
Body Model)
1 kV (Class 1 B)
Operation mode: no
power
JESD22-
A114-D
3 pcs/group
Visual inspection:
ok
Function test: ok
RF specification: ok
ESD with DVK (or
embedded in the
host)
Contact Voltage: ±2
kV, ±4 kV
Air Voltage: ±2 kV, ±4
kV, ±8 kV
Operation mode:
working with service
connected
IEC6100
0-4-2
2 pcs
Visual inspection:
ok
Function test: ok
RF specification: ok
Groups
≥ 2
5.7 EMC and ESD Features
The following are the EMC design comments:
Attention should be paid to static control in the manufacture, assembly, packaging,
handling, and storage process to reduce electrostatic damage to HUAWEI
module.
RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if
the antenna port is protected by TVS (Transient Voltage Suppressor), which is
resolved by making some adjustments on RF match circuit.
TVS should be added on the USB port for ESD protection, and the parasitic
capacitance of TVS on D+/D- signal should be less than 2 pF. Common-mode
inductor should be added in parallel on D+/D- signal.
TVS should be added on the SIM interface for ESD protection. The parasitic
capacitance of TVS on SIM signal should be less than 10 pF.
Resistors in parallel and a 10 nF capacitor should be added on RESET# and
Power_On_Off signal to avoid shaking, and the distance between the capacitor
and the related pin should be less than 100 mil.
