ME60
Hardware Description
1 Hardware Description
Issue 01 (2018-05-07)
278
Attribute
Description
Frame format
Ethernet_II, Ethernet_SAP and Ethernet_SN/AP
Table 1-385
Board specifications
Item
Specification
Dimensions (H x W x D)
37.2 mm x 178.7 mm x 193.3 mm (1.46 in. x 7.04 in. x 7.61
in.)
Typical power
consumption
29.0 W
Typical heat dissipation
94.1 BTU/hour
Weight
0.9 kg (1.98 lb)
Ambient temperature
Long terms: 0 °C to 45 °C (32°F to 113°F) Short terms:
-5 °C to 55 °C (23°F to 131°F)
1.10.7.5 5-Port 10GBase LAN/WAN-SFP+ Flexible Card E(BP100-E)
Overview
Table 1-386
Board attributes
Attribute
Description
Board name silkscreen
BP100-5x10GBase LAN/WAN-SFP+
-E
Description
5-Port 10GBase LAN/WAN-SFP+ Flexible Card
E(BP100-E)
BOM
03030PYS
Model
ME0D0L5XXE7H
Table 1-387
Mapping products and versions
Product
Motherboard
Earliest Software
Version for Flexible
Card
ME60-X3
1.10.7.1 Flexible Card Broadband
Service Unit(BSUF-100,2 sub-slots)
1.10.7.2 Flexible Card Multi Service
V800R008C10