ME60
Hardware Description
1 Hardware Description
Issue 01 (2018-05-07)
256
Table 1-328
Board specifications
Item
Specification
Dimensions (H x W x D)
37.2 mm x 178.7 mm x 193.3 mm (1.46 in. x 7.04 in. x 7.61
in.)
Typical power
consumption
59.0 W
Typical heat dissipation
191.4 BTU/hour
Weight
1 kg (2.2 lb)
Ambient temperature
Long terms: 0 °C to 45 °C (32°F to 113°F) Short terms:
-5 °C to 55 °C (23°F to 131°F)
1.10.5.12 2-Port 10GBase LAN/WAN-SFP+ Flexible Card H(BP51-H)
Overview
Table 1-329
Board attributes
Attribute
Description
Board name silkscreen
BP51-2x10GBase LAN/WAN-SFP+
-H
Description
2-Port 10GBase LAN/WAN-SFP+ Flexible Card
H(BP51-H)
BOM
03031EAX
Model
ME0D0L2XFH7H
Table 1-330
Mapping products and versions
Product
Motherboard
Earliest Software
Version for Flexible
Card
ME60-X3
1.10.5.1 Flexible Card Broadband
Service Unit(BSUF-51,2 sub-slots)
1.10.5.2 Flexible Card Multi Service
Unit(MSUF-51,2 sub-slots)
V800R009C00
ME60-X8
1.10.5.1 Flexible Card Broadband
Service Unit(BSUF-51,2 sub-slots)
1.10.5.2 Flexible Card Multi Service
Unit(MSUF-51,2 sub-slots)
V800R009C00