ME60
Hardware Description
1 Hardware Description
Issue 01 (2018-05-07)
316
Technical Specifications
Table 1-475
Interface specifications
Attribute
Description
Optical type
supported
1.11.5 1Gbps Electrical Transceiver
1.11.6 1.25Gbps eSFP Optical Module
1.11.8 1.25Gbps eSFP CWDM Optical Module
1.11.7 1.25Gbps eSFP BIDI Optical Module
1.11.10 125M~2.67Gbps eSFP DWDM Optical Module
1.11.11 10Gbps SFP+ Optical Module
1.11.12 10Gbps SFP+ CWDM Optical Module
1.11.13 10Gbps SFP+ BIDI Optical Module
1.11.14 10Gbps SFP+ DWDM Optical Module
NOTE
The interface supports GE/10GE auto-sensing.
Working mode
Full-duplex
Compliant
standard
IEEE 802.3
Frame format
Ethernet_II, Ethernet_SAP and Ethernet_SN/AP
Table 1-476
Board specifications
Item
Specification
Dimensions (H x W x D)
37.2 mm x 178.7 mm x 193.3 mm (1.46 in. x 7.04 in. x 7.61
in.)
Typical power
consumption
52.0 W
Typical heat dissipation
168.7 BTU/hour
Weight
0.8 kg (1.65 lb)
Ambient temperature
Long terms: 0 °C to 45 °C (32°F to 113°F) Short terms:
-5 °C to 55 °C (23°F to 131°F)