Acronyms and abbreviations
3DS TSV
three-dimensional stacked through-silicon via (integrated circuit packaging technology)
AOC
active optical cable
BMC
baseboard management controller
CAS
column address strobe
CSR
customer self repair
DAC
direct attach cable
DDR4
double data rate-4
DS
Digitally Signed Firmware (M.2 SSD description)
EDR
enhanced data rate
EMI
electromagnetic interference
GPU
graphics processing unit
LFF
large form factor
LRDIMM
load reduced dual in-line memory module
MU
mixed use (M.2 SSD workload type)
OCP
Open Compute Project
PCA
printed circuit assembly
PCIe
Peripheral Component Interconnect Express
Acronyms and abbreviations
81
Summary of Contents for AR64z
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