EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 SCREW DRIVER(Plum flower head)
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Press the button to remove the hinge assy.
2. Remove the screw and dismantle the back cover of monitor.
3. Remove the key board from rear cover.
4. Remove the screws separate rear cover and mainframe.
5. Disconnect the connector and tear out all tapes .
6. Remove Mylar and screws to remove mainboard and power board.
7. Separate the bezel and panel
8.
9.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Summary of Contents for Z24n G2
Page 6: ...4 ...
Page 7: ...5 Separate the Bezel panel Separate the Bezel panel ...
Page 8: ...6 ...
