2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screw Driver
No.0
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. remove Rubber Foot
2. remove low door
3. remove Battery module
4. remove HDD module
5. remove LCD module
6. remove MB
7. remove speaker module
8. remove K/B module
9. remove T/P module
10. remove I/O board
11. divide Display assy (remove hinge cap TOP)
12. divide Display assy ( remove hinge cap BTN )
13. divide Display assy ( remove LCD cover )
14. divide Display assy (remove Hinge)
15. divide Display assy (remove LVDS Cable)
16. divide Display assy (Antenna cble )
17. divide Display assy ( sensor board )
18. divide Display assy (remove Camera)
19. divide Display assy (remove Panel)
20. divide Display assy ( remove LCD brkt )
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
