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EL-MF877-00                                                                                                Page  1 
Template Revision C  

Last revalidation date 09-May-2018 

                 

 

 

 

 

  

HPI instructions for this template are available at 

EL-MF877-01

  

                 

 

Product End-of-Life Disassembly Instructions 

Product Category: 

Personal Computers

 

 

 

Marketing Name / Model 
[List multiple models if applicable.] 

HP Desktop PC M01 ENERGY STAR 
M01 

Purpose: 

The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions 

for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU 
directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE). 
 
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking 
code on the plastic part. For any questions on plastic marking, please contact 

HP’s Sustainability Contact

.    

1.0

 

Items Requiring Selective Treatment

 

1.1 Items listed below are classified as requiring selective treatment. 
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as 
applicable. 

Item Description 

Notes 

Quantity 
of items 
included 
in product

 

Printed Circuit Boards (PCB) or Printed Circuit 
Assemblies (PCA) 

With a surface greater than 10 sq cm 
 

Batteries, excluding Li-Ion batteries. 

All types including standard alkaline, coin or button 
style batteries   

Li-Ion batteries.  Include all Li-Ion batteries if more 
than one is provided with the product (such as a 
detachable notebook keyboard battery, RTC coin 
cell, etc.) 

Battery(ies) are attached to the product by (

check all 

that apply with an

 

“x” 

inside the

 

“[ ]”): 

[

         

] screws 

[x] snaps 
[

         

] adhesive 

[

         

] other.  Explain 

         

 

NOTE: Add detailed removal procedures including 
required tools in the sections 3.1 and 3.2. 

 

Mercury-containing components 

For example, mercury in lamps, display backlights, 
scanner lamps, switches, batteries   

 

Liquid Crystal Displays (LCD) with a surface greater 
than 100 sq cm 

Includes background illuminated displays with gas 
discharge lamps   

 

Cathode Ray Tubes (CRT) 

 

 

Capacitors / condensers (Containing PCB/PCT) 

 

 

Electrolytic Capacitors / Condensers measuring 
greater than 2.5 cm in diameter or height 

PSU 

External electrical cables and cords 

 DC Cable for External Power Supply 

Gas Discharge Lamps 

 

         

 

         

 

Summary of Contents for End-of-Life

Page 1: ...product which require selective treatment in the right column as applicable Item Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm 2 Batteries excluding Li Ion batteries All types including standard alkaline coin or button style batteries 1 Li Ion batteries Include all Li Ion batteries if more t...

Page 2: ... where components and materials requiring selective treatment can be removed Tool Description Tool Size if applicable Hexagon Screw Driver T 15 Electric Iron QUICK 310 Crisscross Screw Driver PH1 3 0 Product Disassembly Process 3 1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps to remove the exter...

Page 3: ... 01 Step1 Use T 15 screwdriver to Loose thumb screw and remove access panel Step2 Remove front bezel from chassis Step3 Loose screw and remove blank module Step4 Disconnect HDD power cable and HDD SATA cable from 1st HDD Step5 Disconnect ODD power cable and ODD SATA cable from ODD Step6 Press the ODD s latch on ODD cage and remove ODD ...

Page 4: ... 01 Step7 Use T 15 screwdriver to Loose screw Step8 Remove the driver cage from Chassis Step9 Use T 15 screw driver to loose the screws of HDD and remove HDD from HDD cage Step10 Disconnect HDD power cable and HDD SATA cable from 2nd HDD Step11 Loose 2 nd HDD screw and remove the 2 nd HDD Step12 Disconnect CPU Cooler Fan cable from MB ...

Page 5: ...Page 5 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 Step13 Loose the screws and remove cooler fan Step14 Disconnect system fan cable from MB ...

Page 6: ...validation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 Step15 Loose the screws and remove system fan Step16 Disconnect all cables from MB Step17 Remove memory from the MB Step18 Rotate the handle and open it up ...

Page 7: ...tructions for this template are available at EL MF877 01 Step19 Remove the CPU from the board Step20 loose screw from behind panel Step21 remove graphic card from board Step22 Remove the battery from MB Step23 Remove M 2 WLAN card Step24 Loose the screw of rear antenna and remove it ...

Page 8: ...00 Page 8 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 Step25 Loose the all screws of motherboard Step26 Remove motherboard from chassis ...

Page 9: ...tion date 09 May 2018 HPI instructions for this template are available at EL MF877 01 Step27 Remove the screws of PSU from chassis Step28 Press the PSU s latch on chassis Step29 Remove the power supply from chassis Step30 loose screws from top and right ...

Page 10: ...n C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 Step31 Remove the screw and open cage Step32 Loose screws and remove PCB from cage Step33 Take off CAP using electric iron from the PSU ...

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