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EL-MF877-00                                                Page 1 
Template Revision C  

Last revalidation date 04-01-2018 

                 

 

 

 

 

  

HPI instructions for this template are available a

EL-MF877-01

  

                 

 

Product End-of-Life Disassembly Instructions 

Product Category: AIO computer

 

Marketing Name / Model 
[List multiple models if applicable.] 

Name / Model #1 HP 21-b All-in-One PC ENERGY STAR 

 

Purpose: 

The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the 

disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 
2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 
 
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the 
plastic part. For any questions on plastic marking, please contac

HP’s Sustainability Contact

.    

1.0

 

Items Requiring Selective Treatment

 

1.1 Items listed below are classified as requiring selective treatment. 
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. 

Item Description 

Notes 

Quantity of 
items 
included in 
product

 

Printed Circuit Boards (PCB) or Printed Circuit 
Assemblies (PCA) 

With a surface greater than 10 sq cm 
MB*1, Memory*2 or 1, SSD*1 

Batteries, excluding Li-Ion batteries. 

All types including standard alkaline, coin or button style 
batteries  RTC 

Li-Ion batteries.  Include all Li-Ion batteries if more than 
one is provided with the product (such as a detachable 
notebook keyboard battery, RTC coin cell, etc.) 

Battery(ies) are attached to the product by (check all 
that apply with an “x” inside the “[ ]”): 
[          ] screws 
[X] snaps 
[          ] adhesive 
[          ] other.  Explain  
NOTE: Add detailed removal procedures including 
required tools in the sections 3.1/3.2. 

Mercury-containing components 

For example, mercury in lamps, display backlights, 
scanner lamps, switches, batteries   

Liquid Crystal Displays (LCD) with a surface greater than 
100 sq cm 

Includes background illuminated displays with gas 
discharge lamps  LCD 

Cathode Ray Tubes (CRT) 

 

 

Capacitors / condensers (Containing PCB/PCT) 

 

 

Electrolytic Capacitors / Condensers measuring greater 
than 2.5 cm in diameter or height 

 

 

External electrical cables and cords 

 DC Cable for External Power Supply 

 

Gas Discharge Lamps 

 

 

Plastics containing Brominated Flame Retardants 
weighing > 25 grams (not including PCBs or PCAs 
already listed as a separate item above)  

 

 

Summary of Contents for 21-b All-in-One ENERGY STAR

Page 1: ...tem Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm MB 1 Memory 2 or 1 SSD 1 4 Batteries excluding Li Ion batteries All types including standard alkaline coin or button style batteries RTC 1 Li Ion batteries Include all Li Ion batteries if more than one is provided with the product such as a d...

Page 2: ...ver 4 0 5 kgf cm Philips 2 screw driver 5 0 5 kgf cm 3 0 Product Disassembly Process 3 1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps to remove the external enclosure 1 Refer to 2 3 to disassemble Panel system 2 Refer to 4 5 to disassemble FAN Heat sink 3 Refer to 6 7 to disassemble DIMM SSD 4 R...

Page 3: ...alidation date 04 01 2018 HPI instructions for this template are available at EL MF877 01 2 Remove 1 screw between Hinge Front chin 3 Disassemble Panel System then remove LVDS Backlight cable from M B 4 Remove 2 screws for FAN FAN connector from M B ...

Page 4: ... Revision C Last revalidation date 04 01 2018 HPI instructions for this template are available at EL MF877 01 5 Release 4 screws to remove Heat sink 6 Remove SSD by releasing 1 screw 7 Release lock of DIMM on M B then remove DIMM ...

Page 5: ...1 2018 HPI instructions for this template are available at EL MF877 01 8 Release 1 screw to remove power button board and remove FFC from M B 9 Release 2 screws to remove webcam then remove webcam connector from M B 10 Remove Webcam cable Shutter from Webcam assembly ...

Page 6: ...instructions for this template are available at EL MF877 01 11 Release Antenna from WIFI module and release 1 screw to remove WIFI module 12 Remove HDD cable and HDD 2 screws and release 4 screw for removing HDD BKT 13 Remove HDD cable release 4 screws to remove HDD BKT from HDD ...

Page 7: ...for this template are available at EL MF877 01 14 Release 1 screw to remove ODD from MB shielding And remove ODD rubber from ODD Then remove ODD FFC from MB 15 Then we can remove ODD assembly from system 16 Remove ODD cable and ODD bezel from ODD module and release 1 screw to remove ODD BKT ...

Page 8: ...sion C Last revalidation date 04 01 2018 HPI instructions for this template are available at EL MF877 01 17 Release 4 screws to remove speaker and mention the hook for release cable 18 Release 7 screws to remove M B from M B shielding ...

Page 9: ... revalidation date 04 01 2018 HPI instructions for this template are available at EL MF877 01 19 Release 8 screws to remove Hinge from M B shielding 20 Release 4 screws to remove M B shielding from Back cover and we finish dis assembly the unit ...

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