b.
Remove the heat sink (2) from the system board.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Replacement thermal material is included with the
heat sink, processor, and system board spare part kits.
The following illustrations show the replacement thermal material locations.
●
Discrete graphics: Thermal paste is used on the heat sink (1) (3) and associated system board
components (2) (4).
60
Chapter 6 Removal and replacement procedures for Authorized Service Provider parts
Summary of Contents for 17 Laptop PC
Page 4: ...iv Safety warning notice ...
Page 8: ...viii ...
Page 14: ...6 Chapter 1 Product description ...
Page 34: ...26 Chapter 3 Illustrated parts catalog ...
Page 44: ...36 Chapter 5 Removal and replacement procedures for Customer Self Repair parts ...
Page 83: ...Component replacement procedures 75 ...
Page 104: ...96 Chapter 11 Power cord set requirements ...
Page 106: ...98 Chapter 12 Recycling ...
Page 110: ...102 Index ...