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EL-MF877-00                                                                                                Page  2 
Template Revision A 

 

 

  

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components 
and materials requiring selective treatment can be removed. 

Tool Description 

Tool Size (if 
applicable) 

Philips Head Screw Driver 

 # 2

           

          

           

              

         

            

           

          

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:  

1.   Remove the screws securing the bulkhead to PCA using a Philips Head screw driver (16 per for J8729A). 
2.  Remove the EMI gasket from the top (1 per) and the side (2 per) of the bulkhead. Refer to Picture 1 for more details. 
3.  Remove the screws securing the clip to heat sink using a Philips Head screw driver (14 per for J8729A). Refer to 

Picture 2 for more details 

4.  Separate the clip (7 per for J8729A) & standoff (14per for J8729A) and the heat sink. 
5.  Remove the screws securing the guide pins to the PCA using a Philips Head screw driver(1 per for J8729A. Refer to  

Picture 3 for more details. Note the picture shown below is a 16slot fabric module for illustration purposes, you should 
only see 1 guide pin for a slot fabric module.   

6.  Separate the guide pins, heat sink, clip, standoff, EMI gasket, PCA and bulkhead 
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3.2 Optional Graphic.  If the disassembly process is complex, insert a graphic illustration below to identify the items 
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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