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Point to be soldered
For reflow
For dip
Composition of alloy (wt%)
Solder paste: Sn-3Ag-0.5Cu
Bar solder: Sn-0.6Cu
1-3 Lead-Free Solder
The printed circuit board that uses lead-free solder is adopted. To protect the global environment,
use the recommended lead-free solder also during servicing.
Read and observe the following before soldering:
Caution
ALWAYS wear protective goggles during soldering so that no solder smoke or scattered solder
enters the eye. Lead-free solder may scatter at high temperatures of 600°C.
(1) Identification of circuit boards that use lead-free solder
“F” is stamped or noted with pattern letter on circuit boards that use lead-free solder.
(2) Characteristics of lead-free solder
The components of lead-free solder used are as follows. The melting point of lead-free solder is 30-
40°C higher than that of lead based solder:
Melting temperature: Approx. 220°C
Point to be soldered
Surface-mounted (chip) parts [other than
those shown below]
Surface-mounted (chip) parts [for DVD
cameras, cellular phones only]
Discrete parts
Chassis, metal shield, etc.
Tip temperature
320 ± 30°C
[heating time: less than 5 seconds]
350 ± 10°C
[heating time: less than 3 seconds]
380 ± 30°C
420 ± 30°C
(3) Lead-free solder for servicing
Use the following lead-free solder for servicing:
Recommended lead-free solder and composition of alloy (wt%): Sn-3.0Ag-0.5Cu or equivalent
Information:
For composition of alloy, Sn is tin; Ag is silver; Cu is copper; Bi is bismuth; Pb is lead.
(4) Soldering iron for servicing
The temperature of soldering iron tip must be adjusted according to the points to be soldered: Use
an antistatic soldering iron with thermal control function.
When removing components, take care not to damage any surrounding component or pattern. When
attaching components, observe the heating time in the following table so that the components are
not destroyed by heat.
Tip temperatures for different soldering points:
Safety Precaution for Repair > Lead-Free Solder
