399
Appendix F Package Dimensions
Dimensional drawings of the H8/3637 Series in FP-80B, TFP-80F and TFP-80C packages are
shown in figure F.1, F.2 and F.3, respectively.
0.15 M
0
°
– 10
°
*0.37
±
0.08
*0.17
±
0.05
3.10 Max
1.2
±
0.2
24.8
±
0.4
20
64
41
40
25
24
1
80
65
18.8
±
0.4
14
0.15
0.8
2.70
2.4
0.20
+0.10 –0.20
0.8
1.0
0.35
±
0.06
0.15
±
0.04
Unit: mm
*Dimension including the plating thickness
Base material dimension
Figure F.1 FP-80B Package Dimensions
Note:
In case of inconsistencies arising within figures, dimensional drawings listed in the
Hitachi Semiconductor Packages Manual take precedence and are considered correct.