Hitachi GX1000-SMC013X, Instruction Manual

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2.10.3 Cooling conditions for a rack-mounted device
Ensure more than 70 mm of space between the Device and all structural components of
the rack including the side walls, pillars, guide rails and front and rear doors.
Do not block the ventilation slots. Otherwise, the internal heat is not discharged, which
might cause a fire. Ensure at least 70 mm of space from ventilation slots.
NOTE
Be sure that the temperature inside the rack is within the operating temperature
specified for the Device. Otherwise, the Device might malfunction or fail. To bring the
temperature inside the rack within the temperature requirements of the Device,
consider the following methods:
Install fans inside the rack for sufficient ventilation.
To allow good ventilation, replace the front and rear door panels with panels that
have punched holes for cooling, or remove the doors.
If necessary, reduce the number of devices in the rack or mount the Device
under other equipment that emits heat.
NOTE
When equipment with forced air cooling systems is installed above or below the
Device, interference due to the airflow from nearby equipment can adversely affect the
cooling of the Device, which might result in a malfunction.
The exhaust airflow from nearby equipment might be drawn into the Device, and
the air intake temperature of the Device might exceed the environment
requirements.
When nearby equipment has too strong an intake or exhaust air system, reverse
air pressure might affect the Device airflow, decreasing the internal cooling
performance.
Keep spaces between the systems in the rack to prevent air flow interference.