Clearness Requirements
It is required that there are no explosive, conductive, magnetic, and corrosive dusts in the install-
ation site. The dust concentration requirement in the equipment room is shown as below:
Mechanically
Active Sub-
stance
Unit
Concentration
Dust Particle
Particles/m
3
≤3×10
4
(No visible dust on tables within 3
days)
Note: Diameter of dust particle ≥5μm
ESD Prevention
To prevent electrostatic discharge (ESD) damage, ensure that:
l
The device is well grounded. The grounding screw is properly grounded.
l
Take dustproof measures for the equipment room.
l
Maintain proper humidity and temperature levels.
l
Do not disassemble the device without permission from the vendor, or you may cause danger
and void your warranty.
EMI Prevention
All possible Electromagnetic Interference (EMI) sources, external or internal, affect the device in
the way of capacitance coupling, inductance coupling, electromagnetic radiation, and common
impedance (including the grounding system) coupling. To prevent or reduce EMI:
l
Take measures to protect the power system from the interference of the power grid.
l
Separate the protection ground of the device from the grounding device or lighting protection
grounding device of the power supply equipment as far as possible.
61
Chapter 2 Installation Preparations
Summary of Contents for SG-6000 X Series
Page 1: ...Hillstone SG 6000 X Series Hardware Reference Guide TechDocs docs hillstonenet com...
Page 11: ...Troubleshooting the Configuration System 156 Appendix Supported Versions of Devices 158 TOC 9...
Page 40: ...SSM 100 SSM 80 is shown as below SSM 20 is shown as below 28 Chapter 1 Product Profile...
Page 45: ...IOM 16SFP 100 is shown as below IOM 4XFP 100 is shown as below Chapter 1 Product Profile 33...
Page 48: ...SIOM P100 300 is shown as below SIOM P100 260 is shown as below 36 Chapter 1 Product Profile...
Page 80: ...Chapter 2 Installation Preparations 68...
Page 83: ...71 Chapter 2 Installation Preparations...
Page 84: ...Chapter 2 Installation Preparations 72...