GOSUNCN WeLink ME3616 Page 51 Hardware Development Manual Download

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Hardware Development Guide

ME3616

SMT

ROCESS AND

AKING

UIDE

This chapter describes module’s storage, PAD design, SMT process parameters, baking requirements, etc., and it is applicable

for the process guide to second-level assembly of LCC encapsulation module.

7.1.

TORAGE

EQUIREMENTS

Storage conditions: temperature<40

℃

, relative humidity<90% (RH), 12 months weld ability guaranteed under this

circumstances of excellent sealing package.

The Moisture sensitivity level for all modules is level 3 (Conforming to IPC/JEDEC J-STD-020). After opening the package, mount

within 168 hours under the environment conditions of temperature<30

℃

, relative humidity<60% (RH). If it doesn’t meet the above

requirements, perform the baking process. See the baking parameters in Table below:

Table 7-1 Baking parameters

Temperature

Baking conditions

Baking time

Remarks

125± 5

℃

Moisture: ≤60%RH

8 hours

The accumulated baking time must be less than 96 hours

45± 5

℃

Moisture: ≤5%RH

192 hours

The product’s transportation, storage and processing must conform to IPC/JEDEC J-STD-033

When in the process of PAD designing of module, refer to IPC-SM-782A and the chapter 6.2 below.

7.2.

ODULE

LAINNESS

TANDARD

Plainness of the module is required to be less than 0.15mm.

Measurement method:

put the module on the marble plane, use the feeler gage to measure the gap width at the position of

maximum warp, and do not exert force on the module during the measurement.

7.3.

ROCESS

OUTING

ELECTION

The modules are manufactured with the lead-free process and meet the ROHS requirements, therefore it’s recommended to

follow the lead-free manufacturing process upon the selection of process routing for module board and main board.

7.3.1.

OLDER

ASTE

ELECTION

The solder pastes with metal particle TYPE3 and TYPE4 can fulfill the welding requirements. It is accordingly recommended to

use the no-clean solder paste. If the solder paste which needs cleaning is used, we cannot guarantee the components on the module

board could withstand the washing of the cleaning solvents. This might cause the functional problems of such components and affect

the appearance of the module. During the printing process, make sure the solder paste’s thickness at the position of module’s PAD is

within 0.18mm~0.20mm.

7.3.2.

ESIGN OF MODULE

PAD’

S STEEL MESH OPENING ON MAIN BOARD

The thickness of the steel mesh on main board is selected according to the encapsulation type of components on the main

board. Pay attention to the following requirements:

Make sure to design the module PAD on main board according to chapter 5.

The thickness of steel mesh is 0.15mm or 0.18mm, but the thickness at the position of module pad can be increased to

0.18~0.20mm or the thickness of steel mesh is directly 0.18mm~0.20mm on main board.

Summary of Contents for WeLink ME3616

Page 1: ...HARDWARE DEVELOPMENT GUIDE ME3616 Version V1 2 Date 2018 05 29 NB IoT Module Website www gosuncnwelink com E mail welink gosuncn com ...

Page 2: ...nowledge of the module and a clear understanding of the technical parameters With this document the user can successfully fulfill the application and development of wireless Internet product or equipment Besides the product features and technical parameters this document also provides the product reliability tests and related testing standards RF performance indexes and a guide on the design of us...

Page 3: ... Printed Circuit Board PDA Personal Digital Assistant PDU Protocol Data Unit PAP Password Authentication Protocol PPP Point to Point Protocol RTC Real Time Clock SMS Short Messaging Service SMT Surface Mount Technology SPI Serial Peripheral Interface TBD To Be Determined TCP Transmission Control Protocol TIS Total Isotropic Sensitivity TRP Total Radiated Power TVS Transient Voltage Suppressor UART...

Page 4: ...ess devices on boarding the aircraft if your device offers a Airplane Mode which must be enabled prior to boarding an aircraft Switch off your wireless device when in hospitals or clinics or other health care facilities These requests are designed to prevent possible interference with sensitive medical equipment GSM cellular terminals or mobiles operate over radio frequency signal and cellular net...

Page 5: ...NG MODE 15 2 5 POWER SUPPLY 16 2 5 1 Power Supply Pins 16 2 5 2 Decrease Voltage Drop 16 2 5 3 Reference Circuit of Power Supply 17 2 6 VCC1V8_OUT REFERENCE DESIGN 17 2 7 POWER ON SCENARIO 18 2 8 TURN OFF SCENARIOS 21 2 9 RESET SCENARIO 21 2 10 USIM INTERFACE 23 2 10 1 Description of PINs 23 2 10 2 Design Considerations for USIM Card Holder 24 2 11 UART INTERFACE 27 2 11 1 UART connection 27 2 11 ...

Page 6: ...3 5 MECHANICAL DIMENSIONS 44 5 1 MECHANICAL DIMENSIONS OF THE MODULE 44 5 2 RECOMMENDED PACKAGE SIZE 46 6 RELATED TEST TEST STANDARD 47 6 1 TESTING REFERENCE 47 6 2 DESCRIPTION OF TESTING ENVIRONMENT 47 6 3 RELIABILITY TESTING ENVIRONMENT 48 7 SMT PROCESS AND BAKING GUIDE 50 7 1 STORAGE REQUIREMENTS 50 7 2 MODULE PLAINNESS STANDARD 50 7 3 PROCESS ROUTING SELECTION 50 7 3 1 Solder Paste Selection 5...

Page 7: ... Table 2 11 Pin Description of Molex USIM Card Holder 25 Table 2 12 Pin Description of Amphenol USIM Card Holder 26 Table 2 13 Pin Definition of the Main UART Interface 27 Table 2 14 Pin Definition of Network Indicator 34 Table 2 15 Pin Definition of the ADC 35 Table 2 16 Characteristic of the ADC 35 Table 2 17 Pin Definition of GPIO 35 Table 2 18 Pin definition of WAKEUP_IN 36 Table 2 19 Pin defi...

Page 8: ...preading without GOSUNCN Permission VII Hardware Development Guide ME3616 Table 6 3 Testing Instrument Device 48 Table 6 4 Reliability Features 48 Table 7 1 Baking parameters 50 Table 7 2 LCC module PAD s steel mesh opening 51 ...

Page 9: ...inition of the USIM Interface 23 Figure 2 13 reference design of USIM interface 24 Figure 2 14 Molex 91228 USIM Card Holder 25 Figure 2 15 Amphenol C707 10M006 512 2 USIM Card Holder 26 Figure 2 16 Schematic of 3 wire UART Connection 28 Figure 2 17 Schematic of 4 wire UART Connection 28 Figure 2 18 Recommended TXD circuit 29 Figure 2 19 Recommended RXD circuit 30 Figure 2 20 Recommended RTS circui...

Page 10: ...rcuit of Antenna Interface 39 Figure 3 2 The OTA test system of CTIA 41 Figure 5 1 ME3616 Top Dimensions tolerance 0 1mm 44 Figure 5 2 ME3616 Bottom Dimensions perspective view 45 Figure 5 3 Recommended Package Size Unit mm 46 Figure 7 1 Module Board s Steel Mesh Diagram 51 Figure 7 2 Material Module Pallet 52 Figure 7 3 Tape Reel Dimension 52 Figure 7 4 Module Furnace Temperature Curve Reference ...

Page 11: ...1785 MHz 824 to 849 MHz 880 to 915 MHz 832 to 862 MHz 703 to 748 MHz 2110 to 2170 MHz 1805 to 1880 MHz 869 to 894 MHz 925 to 960 MHz 791 to 821 MHz 758 to 803 MHz 1 2 KEY FEATURES The table below describes the detailed features of the ME3616 module Table 1 2 ME3616 Key Features Feature Description Pysical 16mm 18 mm 2 3mm 40 pins LCC package Power Supply The range of voltage supply is2 85V 3 6V ty...

Page 12: ...he figure below shows a block diagram of the ME3616 and illustrates the major functional parts Power management Baseband Memory RF send receive Peripheral interface UART interface USIM card interface SPI interface master mode I2C interface ADC interface Status interface LED GPIO Baseband USIM UART I2C SPI ADC Flash PSRAM RF Transceiver RF PA Duplexer Switch Tx Rx MAIN_ANT LCC GPIO SYS_STATE Power ...

Page 13: ... pins LCC package that connect to customer s cellular application platform Sub interface included in these pads is described in detail in the following chapters 2 2 PIN ASSIGNMENT The following figure shows the pin assignment of the ME3616 module Figure 2 1 Pin Assignment Note Keep all NC pins unconnected 2 3 PIN DESCRIPTION The following table shows the IO Parameters Definition PIN1 ...

Page 14: ...bles show the ME3616 s pin definition Table 2 3 Pin Description Power Supply Pin Name Pin NO I O Description DC Characteristics Comment VBAT 31 PI Power supply for module 2 85V 3 6V typical value is 3 0V Required This pin is strongly related to the SIM card voltage If you want to support 3V SIM VBAT supply must between 3 3 3 6V VBAT 32 PI Power supply for module 2 85V 3 6V typical value is 3 0V VC...

Page 15: ...f USIM card ADC Interface ADC 38 AI Analog to digital 0V to 1 4V External sensor signal detection with 10bit accuracy Main UART Interface UART1_TXD 9 DO Transmit data 1 8V UART1_RXD 10 DI Receive data 1 8V UART1_RTS 8 DO Request to send 1 8V UART1_CTS 7 DI Clear to send 1 8V Debug UART Interface UART_DEBUG_ TXD 1 DO UART2 transmit data 1 8V Required please Reserve test point UART_DEBUG_ RXD 2 DI U...

Page 16: ...nk data AP_READY 11 DI AP is Ready 1 8V GPIO 34 35 IO General input output 1 8V If not used NC NC 24 Not connected No need connection external 2 4 WORKING MODE There is three working mode for module ME3616 1 Connected mode Network connection is ongoing and you can send receive data the power consumption is decided by network setting and data transfer rate Module can enter Idle PSM mode in this sta...

Page 17: ...s the power and signal ground of the module which needs to be connected to the ground on the system board If the GND signal is not connected completely the performance of module will be affected 2 5 2 DECREASE VOLTAGE DROP Power supply range of the module is 2 85V 3 6V So we recommended to add Energy storage capacitor C6 100μF Filter capacitors 10µF 0 1µF 33pF need to be added to reduce interferen...

Page 18: ...supply needs to be above 800mA When the input and output voltage difference is large you need to select Buck circuit to improve translate efficiency Two reference power supply circuit design with DC DC is shown as figure below The output voltage can be adjusted by through the resistance of R1 R2 For details refer to the user s manual of TPS6208833 Figure 2 4 Reference circuit of DC DC 2 6 VCC1V8_O...

Page 19: ...n Name Pin NO I O Description Comment POWER_ON 19 DI Turn on off the module low active the voltage level is VBAT Please pay attention to level matching When MCU can provide high low level pulse with adjustable length the reference circuit to turn on off module is as shown in the following figure below The resistors in Figures below are only the recommended value and they need to adjust according t...

Page 21: ...g of Turning on Module POWER_ON Module Status Wakeup status Sleeping Figure 2 8 Timing of wakeup Module through pin POWER_ON Note When the module is in PSM mode if you want to wake up module by yourself you can only control it by POWER_ON WAKEUP_IN pin so we recommended connecting this pin to GPIO of MCU instead of connecting to ground Table 2 7 Power on Time Parameter Description Min Typical Max ...

Page 22: ...above Table 2 8 Power off Time Parameter Description Min Typical Max Unit T3 The duration of the power off signal 3 4 5 second T4 The period that the VBAT signal should be kept after power off operation is down 1 second VBAT high level POWER_ON Module Status Turning off Running T3 T4 Power off Figure 2 9 Timing of Turning off Mode Mode 2 Send command of AT ZTURNOFF to turn off the module Note when...

Page 23: ...ed to adjust according to the actual situation The table below is the information of RESET pin Table 2 9 Definition of RESET Pin Name Pin NO I O Description Comment RESET 17 DI Reset module VBAT Power domain active low Please pay attention to level matching Figure 2 10 reference circuit to reset module The RESET timing are shown in the table and figure below Table 2 10 Resetting timing Parameter D...

Page 24: ...cuitry meets ETSI and IMT 2000 SIM interface requirements Both 1 8V and 3 0V USIM cards are supported Actual support voltage is related to VBAT If 3V SIM is to be supported VBAT must provide 3 3 3 6V Figure 2 12 Pin Definition of the USIM Interface Pin Name Pin NO I O Description USIM_VCC 15 PO Power supply for USIM card USIM_DATA 14 IO Data signal of USIM card USIM_CLK 13 DO Clock signal of USIM ...

Page 25: ...ple capacitor of USIM_VCC should be less than 1uF and must be near to USIM cassette To avoid cross talk between USIM_DATA and USIM_CLK keep them away with each other and shield them with surrounded ground In order to offer good ESD protection it is recommended to add TVS such as WILL http www willsemi com ESDA6V8AV6 The 33Ω resistors should be added in series between the module and the USIM card s...

Page 26: ...x USIM Card Holder Pin Name Pin NO Function GND 1 Ground VPP 2 Not connected DATA I O 3 USIM card data CLK 4 USIM card clock RST 5 USIM card reset VDD 6 USIM card power supply DETECT 7 USIM card Detection NC 8 Not defined Connect to Ground For 6 pin USIM card holder it is recommended to use Amphenol C707 10M006 512 2 Please visit http www amphenol com for more information ...

Page 27: ...t Guide ME3616 Figure 2 15 Amphenol C707 10M006 512 2 USIM Card Holder Table 2 12 Pin Description of Amphenol USIM Card Holder Pin Name Pin NO Function GND 1 Ground VPP 2 Not connected DATA I O 3 USIM card data CLK 4 USIM card clock RST 5 USIM card reset VDD 6 USIM card power supply ...

Page 28: ...omer must start from the power on of the module without delay and send AT r n to the module every 200 500ms until the module returns OK At this time it is deemed that the baud rate adaptation is successful Can send other AT commands Debug UART interface supports 115200bps baud rate It can be used for software debug and firmware upgrade The module is designed as the DCE Data Communication Equipment...

Page 29: ...T_RTS UART_CTS UART_DTR UART_DCD UART_RI Figure 2 17 Schematic of 4 wire UART Connection 2 11 2 UART LEVEL MATCH Notice the level match when connect module to external MCU Level must be less than 3 0V under normal operation and its default speed rate is 115200 bps We recommend to use Triode or IC for UART level match circuit The pictures below are the recommended level switch circuit for TXD RXD C...

Page 34: ...ART level switch circuit Figure 2 23 Recommended 2 wires UART level switch circuit Debug UART interface Figure 2 24 Debug UART interface definication Pin Name Pin NO I O Description Comment UART_DEBUG_TXD 1 DO Data send 1 8V Required please Reserve test point UART_DEBUG_RXD 2 DI data receive 1 8V Required please Reserve test point ...

Page 35: ... The following tables describe pin definition and logic level changes in different network status Table 2 14 Pin Definition of Network Indicator Pin Name Pin NO I O Description Comment SYS_STATE 21 DO There are 4 status 1 power off the same as there is no power supply 2 offline Frequency 1Hz Duty cycle 50 3 online Frequency 0 3Hz Duty cycle 10 4 data sending Frequency 10Hz Duty cycle 50 1 8V power...

Page 36: ...ument AT Command Reference Guide of Module Product ME3616 In order to improve the accuracy of ADC the trace of ADC should be surrounded by ground Table 2 15 Pin Definition of the ADC Pin Name Pin NO Description ADC1 38 General purpose analog to digital converter The following table describes the characteristic of the ADC function Table 2 16 Characteristic of the ADC Item Min Max Unit ADC voltage r...

Page 37: ...to wakeup module need to pull up by resistor external If module in PSM status Falling edge can wakeup the module You can use command AT ZSLR to enable the sleep status of module When the module needs to be waken up input a related signal via WAKEUP IN The following figure is the signal waveform WAKEUP_IN High Low Module status Sleep Wakeup High sleep Enabled status Send AT ZSLR to enable sleep sta...

Page 38: ..._OUT Pin Name Pin NO I O Description Comment WAKEUP_OUT 16 DO Output wakeup signal wake up the external devices Used for module to wakeup MCU such as this pin will give 1 second low level signal when there is downlink data The following figure is the signal waveform Module state Operating state Sleep state low High WAKEUP_OUT 1s Figure 2 29 WAKEUP_OUT output sequence The resistors R45 R47 and R59 ...

Page 39: ...INTERFACE As USB is only used for debug when this interface is connected USB_VBUS need to connect to 3 3V power supply you can connect differential signal power and GND via test points or to the standard pin header We recommended to let the USB interface not connected NC Figure 2 31 USB interface connection ...

Page 40: ...sition of the antenna all affect the radiation performance of the antenna too The reference design of main antenna is shown as below It should reserve a double L type matching circuit for better RF performance and place these components as close as possible to the module The capacitors are not mounted by default Figure 3 1 Reference Circuit of Antenna Interface 3 3 REFERENCE PCB LAYOUT OF ANTENNA ...

Page 41: ...d be far from modules and components that might generate EMI such as chip and memory power interface and data cable interface The wiring of RF cables should be close to the ground of the mainboard During the layout and wiring of peripheral circuits for the wiring of power and signal cables keep a distance of 2 times of the line width so as to effectively reduce the coupling between signals and kee...

Page 43: ...ent consumption Parameter Condition Typical Value Unit Power off Shutdown leakage current 2 5 μA PSM mode Power Save Mode 4 μA eDRX mode Base current 45 μA PTW 5 12S eDRX cycle 20 48S DRX cycle 2 56S 125 μA IDLE Idle mode 292 μA Working current in NB IoT LTE FDD Band 1 Pout 23dBm 92 mA LTE FDD Band 3 Pout 23dBm 99 mA LTE FDD Band 5 Pout 23dBm 105 mA LTE FDD Band 8 Pout 23dBm 105 mA LTE FDD Band 20...

Page 44: ...re transmission 4 5 ELECTROSTATIC DISCHARGE The module is not protected against electrostatics discharge ESD in general Consequently it is subject to ESD handling precautions that typically apply to ESD sensitive components Proper ESD handling and packaging procedures must be applied throughout the processing handling and operation of any application that incorporates the module The following tabl...

Page 45: ...mission 44 Hardware Development Guide ME3616 5 MECHANICAL DIMENSIONS This chapter describes the mechanical dimensions of the module All dimensions are measured in mm 5 1 MECHANICAL DIMENSIONS OF THE MODULE Figure 5 1 ME3616 Top Dimensions tolerance 0 1mm ...

Page 47: ...ut GOSUNCN Permission 46 Hardware Development Guide ME3616 5 2 RECOMMENDED PACKAGE SIZE Figure 5 3 Recommended Package Size Unit mm Note In order to maintain the module keep about 3mm between the module and other components in the host PCB ...

Page 48: ...thod part 4 Strict level of experimental condition GB T 2423 17 Basic environment experiment of electronic products Experiment Ka Salt mist experiment method GB T 2423 5 Basic environment experiment of electronic products Part2 Experiment method Try Ea Introduction Shock GB T 2423 11 Basic environment experiment of electronic products Part2 Experiment method Try Fd Broad frequency band random vibr...

Page 49: ...h low temperature running high low temperature storage and temperature shock experiment test Refer to Table 6 4 for the specific parameters Table 6 4 Reliability Features Test Item Test Condition Test Standard Random vibration Frequency range 5 20Hz PSD 1 0m2 s3 Frequency range 20 200Hz 3dB oct 3 axis 1 hour for each axis IEC 68 2 6 Temperature shock Low temperature 40 C 2 C High temperature 80 C ...

Page 51: ...d put the module on the marble plane use the feeler gage to measure the gap width at the position of maximum warp and do not exert force on the module during the measurement 7 3 PROCESS ROUTING SELECTION The modules are manufactured with the lead free process and meet the ROHS requirements therefore it s recommended to follow the lead free manufacturing process upon the selection of process routin...

Page 52: ... scale in the direction of width extend 0 3mm outward in the direction of length G 0 5mm Contract 0 05 0 1mm in the direction of width Contract 0 05 0 1mm inward in the direction of length extend 0 5mm outward in the direction of length Figure 7 1 Module Board s Steel Mesh Diagram 7 3 3 MODULE BOARD S SMT PROCESS 1 SMT Tape Reel The tape reels which are suitable for SMT have been made for most GOS...

Page 53: ... following picture is the tape reel specific dimension for your reference A Whole dimension B Detailed dimension Figure 7 3 Tape Reel Dimension 3 Mounting Pressure In order to ensure a good contact between the module and the solder paste on main board the pressure of placing the module board on main board should be 2 5N according to our experiences Different modules have different numbers of pads ...

Page 54: ... Module Furnace Temperature Curve Reference Diagram 7 3 5 REFLOW METHOD If the main board used by customers is a double sided board it is recommended to mount the module board at the second time In addition it is preferable for the main board to reflow on the mesh belt when mounting at the first time and the second time If such failure is caused by any special reason the fixture should be also use...

Page 55: ...ronment Refer to the following environment requirements WARNING The product s transportation storage and processing must conform to IPC JEDEC J STD 033 7 4 2 BAKING DEVICE AND OPERATION PROCEDURE Baking device Any oven where the temperature can rise up to 125 C or above Precautions regarding baking during the baking process the modules should be put in the high temperature resistant pallet flatly ...

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