Gerber Dimension 200, Manual

Page: 87 / 111

System Preparation and Use 87
When using T-Vac vacuum hold-down, follow these guidelines:
„
The workpiece must be flat.
„
Do not use T-Vac with porous materials, very thick materials,
or materials with irregular surfaces.
„
The workpiece must cover most of the vacuum holes. Up to 30
holes may be uncovered at the start of the job. Additional
holes may be uncovered as the job progresses. Use scrap
material to cover the holes that are not covered by the
workpiece.
„
Use the Chip Removal System and keep the table surface
clean.
USING BOTH CLAMPS AND T-VAC
For large jobs, it is advisable to also clamp the workpiece to
prevent movement if a power outage or other condition interrupts
the vacuum.
Using the Chip Removal System
Use the Chip Removal System when cutting plastic, Styrofoam,
and wood. Disconnect the removal system when pen plotting or
cutting metals such as aluminum or brass.
CAUTION: The Chip Removal System cannot be used with the
Mist Coolant System
.
To use the Chip Removal System
1. Make sure that the Chip Removal System has been properly
installed. (See the section on installation, if necessary.)
2. Press the START key on the ARC station to start the job. The
vacuum is switched on by the electrical box when the job
starts.