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Gemalto Cinterion ELS81-US Hardware Interface Description Download Page 100

Cinterion

®

 ELS81-US Hardware Interface Description

6 Document Information

104

els81-us_hid_v01.004

2017-09-27

Confidential / Preliminary

Page 100 of 107

6

Document Information

6.1

Revision History

New document:

 

"Cinterion

®

 ELS81-US Hardware Interface Description" Version 01.004

6.2

Related Documents

[1]

ELS81-US AT Command Set

[2]

ELS81-US Release Note

[3]

Application Note 48: SMT Module Integration

[4]

Application Note 40: Thermal Solutions

[5]

Universal Serial Bus Specification Revision 2.0, April 27, 2000

6.3

Terms and Abbreviations

Chapter

What is new

--

Initial document setup.

Abbreviation

Description

ADC

Analog-to-digital converter

AGC

Automatic Gain Control

ANSI

American National Standards Institute

ARFCN

Absolute Radio Frequency Channel Number

ARP

Antenna Reference Point

ASC0/ASC1

Asynchronous Controller. Abbreviations used for first and second serial interface of 

ELS81-US

B

Thermistor Constant

BER

Bit Error Rate

BIP

Bearer Independent Protocol

BTS

Base Transceiver Station

CB or CBM

Cell Broadcast Message

CE

Conformité Européene (European Conformity)

CHAP

Challenge Handshake Authentication Protocol

CPU

Central Processing Unit

CS

Coding Scheme

CSD

Circuit Switched Data

Summary of Contents for Cinterion ELS81-US

Page 1: ... GEMALTO COM M2M Cinterion ELS81 US Hardware Interface Description Version 01 004 DocId els81 us_hid_v01 004 ...

Page 2: ... CONTEXT OF THE DELIV ERY OF THE PRODUCT THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUED ACCORDING TO GERMAN LAW Copyright Transmittal reproduction dissemination and or editing of this document as well as utilization of its con tents and communication thereof to others without express authorization are prohibited Offenders will be held liable for payment of damages All rights created by patent g...

Page 3: ...2 2 1 7 RTC Backup 33 2 1 8 GPIO Interface 34 2 1 9 I2 C Interface 36 2 1 10 SPI Interface 38 2 1 11 PWM Interfaces 39 2 1 12 Pulse Counter 39 2 1 13 Control Signals 39 2 1 13 1 Status LED 39 2 1 13 2 Power Indication Circuit 40 2 1 13 3 Host Wakeup 40 2 1 13 4 Fast Shutdown 41 2 2 RF Antenna Interface 42 2 2 1 Antenna Interface Specifications 42 2 2 2 Antenna Installation 44 2 2 3 RF Line Routing...

Page 4: ...ommand 72 3 5 Operating Temperatures 73 3 6 Electrostatic Discharge 74 3 6 1 ESD Protection for Antenna Interfaces 74 3 7 Blocking against RF on Interface Lines 75 3 8 Reliability Characteristics 77 4 Mechanical Dimensions Mounting and Packaging 78 4 1 Mechanical Dimensions of ELS81 US 78 4 2 Mounting ELS81 US onto the Application Platform 80 4 2 1 SMT PCB Assembly 80 4 2 1 1 Land Pattern and Sten...

Page 5: ... 5 1 Directives and Standards 93 5 2 SAR requirements specific to portable mobiles 96 5 3 Reference Equipment for Type Approval 97 5 4 Compliance with FCC and IC Rules and Regulations 98 6 Document Information 100 6 1 Revision History 100 6 2 Related Documents 100 6 3 Terms and Abbreviations 100 6 4 Safety Precaution Notes 104 7 Appendix 105 7 1 List of Parts and Accessories 105 ...

Page 6: ...behavior 64 Table 12 Voltage supply ratings 69 Table 13 Current consumption ratings typical ratings to be confirmed 70 Table 14 Board temperature 73 Table 15 Electrostatic values 74 Table 16 EMI measures on the application interface 76 Table 17 Summary of reliability test conditions 77 Table 18 Reflow temperature ratings 84 Table 19 Storage conditions 85 Table 20 Directives 93 Table 21 Standards o...

Page 7: ...andard FR4 PCB example 2 47 Figure 24 Micro Stripline on 1 5mm Standard FR4 PCB example 1 48 Figure 25 Micro Stripline on 1 5mm Standard FR4 PCB example 2 49 Figure 26 Routing to application s RF connector top view 50 Figure 27 Schematic diagram of ELS81 US sample application 52 Figure 28 Sample level conversion circuit 53 Figure 29 Sample circuit for applying power using an external µC 56 Figure ...

Page 8: ...hid_v01 004 2017 09 27 Confidential Preliminary Page 8 of 107 Figure 51 Moisture barrier bag MBB with imprint 89 Figure 52 Moisture Sensitivity Label 90 Figure 53 Humidity Indicator Card HIC 91 Figure 54 Tray dimensions 92 Figure 55 Reference equipment for Type Approval 97 ...

Page 9: ...ower according to Release 99 Class 3 24dBm 1 3dB for UMTS 1900 WCDMA FDD BdII Class 3 24dBm 1 3dB for UMTS AWS WCDMA FDD BdIV Class 3 24dBm 1 3dB for UMTS 850 WCDMA FDD BdV Output power according to Release 8 Class 3 23dBm 2dB for LTE 1900 LTE FDD Bd2 Class 3 23dBm 2dB for LTE AWS LTE FDD Bd4 Class 3 23dBm 2dB for LTE 850 LTE FDD Bd5 Class 3 23dBm 2dB for LTE 700 LTE FDD Bd12 Power supply 3 0V to ...

Page 10: ...artphone SIM Application Toolkit SAT letter classes b c e with BIP Firmware update Generic update from host application over ASC0 or USB modem Interfaces Module interface Surface mount device with solderable connection pads SMT application interface Land grid array LGA technology ensures high solder joint reli ability and allows the use of an optional module mounting socket For more information on...

Page 11: ... signal FST_SHDN instead of AT command Automatic switch off in case of critical temperature or voltage conditions Reset Orderly shutdown and reset by AT command Emergency reset by hardware signal EMERG_RST Special features Real time clock Timer functions via AT commands Evaluation kit Evaluation module ELS81 US module soldered onto a dedicated PCB that can be connected to an adapter in order to be...

Page 12: ...es ASC1 SPI CONTROL RTC POWER Rx diversity antenna UMTS LTE Module SIM interface with SIM detection SIM card Application Power supply Backup supply Emergency reset ON Serial interface SPI interface Serial modem interface lines I2C GPIO 3 4 4 5 2 9 1 1 1 2 USB Rx diversity 1 Status LED 1 DAC PWM PWM 2 Fast shutdown Fast shutdown 1 1 COUNTER Pulse counter 1 ASC0 lines Serial modem interface lines SP...

Page 13: ...1 US module and illustrate the major functional components Figure 2 ELS81 US block diagram SD1 SD2 SD2 LDOs PMU LDOs ON Reset_BB SD3 I2CDAT I2CCLK USB GPIO SIM CCIN LPDDR2 SDRAM FLASH VDD VDD ADQ0 ADQ15 DDR_CA_0 DDR _CA_9 DDR _DQ_0 DDR_DQ_15 Control Control CCIN SIM GPIO ASC0 USB I2C ON circuit ON EMERG_RST BATT BB RX TX RF control V180 Baseband controller and Power management USIF1 GPIO FST_SHDWN...

Page 14: ...lter Band4 SAW Filter Band5 SAW Filter Band12 SAW Filter Diversity Antenna Band2 Duplexer Band4 Duplexer Band5 Duplexer Band12 Duplexer Antenna Coupler B2_OUT B4_OUT B5_OUT B12_OUT 4G_HB_IN 2G 3G_HB_IN 4G_LB_IN 2G 3G_LB_IN TQ_H TP_H TQ_L TP_L RX_M1 RX_M1X RX_H4 RX_H4X RX_L1 RX_L1X RX_L3 RX_L3X 4G_HB_IN 4G_HB_IN 4G_HB_IN 4G_HB_IN TRX4 TRX6 TRX5 TRX2 TRX2 TRX1 TRX3 TRX5 PA DCDC SKY87000 BATT RF FBR_...

Page 15: ...ring plan the following Table 1 lists the pads assignments Figure 4 Numbering plan for connecting pads bottom view Supply pads BATT Control pads GND pads ASC0 pads Combined GPIO ASC1 SPI pads SIM pads I2C pads Supply pads Other Combined GPIO Control pads LED PWM COUNTER FST_SHDN USB pads GPIO pads 218 217 216 215 214 213 212 211 210 209 208 207 206 205 204 203 202 201 33 32 31 30 29 28 27 26 25 24...

Page 16: ...GPIO12 55 GND 212 TXD0 222 GPIO11 56 ANT_DRX 213 GPIO24 RING0 223 GND 57 GND 214 RTS0 224 Not connected 58 GND 215 VDDLP 225 GND 59 ANT_MAIN 216 CCRST 226 Not connected 60 GND 217 CCIN 227 GND 61 GND 218 CCIO 228 Not connected 62 GND 219 GPIO14 229 GPIO4 FST_SHDN 63 GND 220 GPIO13 230 GPIO3 DSR0 SPI_CLK 64 Not connected 20 CCVCC 231 GPIO2 DCD0 65 Not connected 21 CCCLK 232 GPIO1 DTR0 66 Not connec...

Page 17: ...F 150µF If using Multilayer Ceramic Chip Capacitors MLCC please take DC bias into account Note that minimum ESR value is advised at 70mΩ Power supply GND Ground Application Ground External supply voltage V180 O Normal operation VOnorm 1 80V 3 IOmax 10mA SLEEP mode Operation VOSleep 1 80V 5 IOmax 10mA CLmax 100µF V180 should be used to supply level shifters at the interfaces or to supply external a...

Page 18: ...ementers Forum USB 2 0 Specification If unused keep lines open USB_DN I O Full and high speed signal characteris tics according USB 2 0 Specification USB_DP Serial Interface ASC0 RXD0 O VOLmax 0 25V at I 1mA VOHmin 1 55V at I 1mA VOHmax 1 85V If unused keep lines open Note that some ASC0 lines are originally avail able as GPIO lines If configured as ASC0 lines the GPIO lines are assigned as follow...

Page 19: ...PIO19 CTS1 TXD1 I RTS1 I CTS1 O SIM card detection CCIN I RI 110kΩ VIHmin 1 45V at I 15µA VIHmax 1 9V VILmax 0 3V CCIN High SIM card inserted For details please refer to Section 2 1 6 If unused keep line open 3V SIM Card Inter face CCRST O VOLmax 0 30V at I 1mA VOHmin 2 45V at I 1mA VOHmax 2 90V Maximum cable length or copper track to SIM card holder should not exceed 100mm CCIO I O VILmax 0 50V V...

Page 20: ...2CCLK IO Open drain IO VOLmin 0 35V at Imax 4mA Imax Imax external I pull up VOHmax 1 85V R external pull up min 560Ω VILmax 0 35V VIHmin 1 3V VIHmax 1 85V According to the I2 C Bus Specification Version 2 1 for the fast mode a rise time of max 300ns is per mitted There is also a maximum VOL 0 4V at 3mA specified The value of the pull up depends on the capaci tive load of the whole sys tem I2 C Sl...

Page 21: ...mmand for alternative functions GPIO1 GPIO3 ASC0 control lines DTR0 DCD0 and DSR0 GPIO4 Fast shutdown GPIO5 Status LED line GPIO6 GPIO7 PWM GPIO8 Pulse Counter GPIO16 GPIO19 ASC1 or SPI GPIO24 ASC0 control line RING0 GPIO4 IO GPIO5 IO GPIO6 IO GPIO7 IO GPIO8 IO GPIO11 GPIO15 IO GPIO16 GPIO19 IO GPIO20 GPIO23 IO GPIO24 IO Fast shutdown FST_SHDN I VILmax 0 35V VIHmin 1 30V VIHmax 1 85V ___ low impul...

Page 22: ...rnal up resistor active VILmax 0 35V at 200µA VIHmin 1 30V at 50µA VIHmax 1 85V If unused keep line open Note that the COUNTER line is originally available as GPIO line If config ured as COUNTER line the GPIO line is assigned as follows GPIO8 COUNTER ADC Analog to Digital Con verter ADC1 I RI 1MΩ VI 0V 1 2V valid range VIH max 1 2V Resolution 1024 steps Tolerance 0 3 ADC can be used as input for e...

Page 23: ...means current sourcing towards ELS81 US Parameter Min Max Unit Supply voltage BATT BB BATT RF 0 5 5 5 V Voltage at all signal lines in Power Down mode 0 3 0 3 V Voltage at digital lines in normal operation 0 2 V180 0 2 V Voltage at SIM USIM interface CCVCC in normal operation 0 5 3 3 V VDDLP input voltage 0 15 2 0 V Voltage at ADC line in normal operation 0 1 2 V V180 in normal operation 1 7 1 9 V...

Page 24: ...cification Revision 2 0 1 Figure 5 USB circuit To properly connect the module s USB interface to the external application a USB 2 0 compat ible connector and cable or hardware design is required For more information on the USB re lated signals see Table 2 Furthermore the USB modem driver distributed with ELS81 US needs to be installed 1 The specification is ready for download on http www usb org d...

Page 25: ...e Suspended state it commands the Host Con troller to stop all bus traffic including SOFs This causes all USB devices to enter the Sus pended state In this state the USB System may enable the Host Controller to respond to bus wakeup events This allows the Host Controller to respond to bus wakeup signaling to restart the host system Implementation for legacy USB applications not supporting USB Susp...

Page 26: ... control lines DTR0 DSR0 DCD0 and RING0 The RING0 signal serves to indicate incoming calls and other types of URCs Unsolicited Result Code It can also be used to send pulses to the host application for example to wake up the application from power saving state Configured for 8 data bits no parity and 1 stop bit ASC0 can be operated at fixed bit rates from 1 200bps up to 921 600bps Autobauding supp...

Page 27: ...TR0 line to prevent shorts high current flow No data must be sent over the ASC0 interface before the interface is active and ready to re ceive data see Section 3 2 1 An external pull down to ground on the DCD0 line during the startup phase activates a special mode for ELS81 US In this special mode the AT command interface is not available and the module may therefore no longer behave as expected T...

Page 28: ...S1 Configuration is done by AT command see 1 AT SCFG The configuration is non volatile and becomes active after a module restart ELS81 US is designed for use as a DCE Based on the conventions for DCE DTE connections it communicates with the customer application DTE using the following signals Port TXD application sends data to module s TXD1 signal line Port RXD application receives data from the m...

Page 29: ...e following figure shows the startup behavior of the asynchronous serial interface ASC1 For pull down values see Table 10 Figure 9 ASC1 startup behavior TXD1 GPIO17 RXD1 GPIO16 RTS1 GPIO18 CTS1 GPIO19 ON EMERG_RST PD PD PD PD Power supply active Start up Firmware initialization Command interface initialization Interface active Reset state V180 VCORE PD ...

Page 30: ... can be given nor any liability accepted if loss of data is encountered after removing the SIM card during operation Also no guarantee can be given for properly initializing any SIM card that the user inserts after having removed the SIM card during operation In this case the application must restart ELS81 US Note 2 On the evaluation board the CCIN signal is inverted thus the CCIN signal is by def...

Page 31: ...n ELS81 US and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51 010 1 and to satisfy the requirements of EMC compliance To avoid possible cross talk from the CCCLK signal to the CCIO signal be careful that both lines are not placed closely next to each other A useful approach is using a GND line to shield the CCIO line from the CCCLK ...

Page 32: ...is possible to add ESD diodes to the SIM interface lines as shown in the example given in Figure 11 1 The example was designed to meet ESD protection according ETSI EN 301 489 1 7 Contact discharge 4kV air discharge 8kV Figure 11 SIM interface enhanced ESD protection 1 Note that the protection diode shall have low internal capacitance less than 5pF for IO and CLK CCRST CCCLK CCIO CCVCC CCIN GND 1 ...

Page 33: ...ernal LDO of ELS81 US If the voltage supply at BATT is dis connected the RTC can be powered by the capacitor The size of the capacitor determines the duration of buffering when no voltage is applied to ELS81 US i e the greater the capacitor the longer ELS81 US will save the date and time The RTC can also be supplied from an external battery rechargeable or non chargeable In this case the electrica...

Page 34: ...ing table shows the configuration variants for the GPIO pads All variants are mutu ally exclusive i e a pad configured for instance as Status LED is locked for alternative usage After startup the above mentioned alternative GPIO line assignments can be configured using AT commands see 1 The configuration is non volatile and available after module restart Table 5 GPIO lines and possible alternative...

Page 35: ...avior of the GPIO interface With an active state of the ASC0 interface i e CTS0 is at low level the initialization of the GPIO interface lines is also finished For pull down values see Table 10 Figure 13 GPIO startup behavior GPIO 1 8 PD CTS0 ON EMERG_RST Power supply active Start up Firmware initialization Command interface initialization Interface active Reset state V180 VCORE GPIO 11 24 PD ...

Page 36: ...eives data only on request of the module To configure and activate the I2C bus use the AT SSPI command Detailed information on the AT SSPI command as well explanations on the protocol and syntax required for data transmis sion can be found in 1 The I2 C interface can be powered via the V180 line of ELS81 US If connected to the V180 line the I2 C interface will properly shut down when the module en...

Page 37: ...ior of the I2 C interface With an active state of the ASC0 interface i e CTS0 is at low level the initialization of the I2 C interface is also finished Figure 15 I2 C startup behavior I2CCLK I2CDAT Open Drain Open Drain external pull up external pull up CTSx ON EMERG_RST Power supply active Start up Firmware initialization Command interface initialization Interface active Reset state V180 VCORE ...

Page 38: ...is non volatile and becomes active after a module restart The GPIO lines are also shared with the ASC1 signal lines and the ASC0 modem status signal line DSR0 To configure and activate the SPI interface use the AT SSPI command Detailed information on the AT SSPI command as well explanations on the SPI modes required for data transmis sion can be found in 1 In general SPI supports four operation mo...

Page 39: ...ality are mutually exclusive The startup behavior of the lines is shown in Figure 13 2 1 12 Pulse Counter The GPIO8 line can be configured as pulse counter line COUNTER The pulse counter inter face can be used for example as a clock for GPIOs see Section 2 1 8 2 1 13 Control Signals 2 1 13 1 Status LED The GPIO5 interface line can be configured to drive a status LED that indicates different oper a...

Page 40: ...s the module s active state with a low signal and the module s Power Down mode with a high signal or high impedance state Figure 18 Power indication circuit 2 1 13 3 Host Wakeup If no call data or message transfer is in progress the host may shut down its own USB inter face to save power If a call or other request URC s messages arrives the host can be noti fied of these events and be woken up aga...

Page 41: ...own The fast shutdown procedure still finishes any data activities on the module s flash file system thus ensuring data integrity but will no longer deregister gracefully from the network thus saving the time required for network deregistration Figure 19 Fast shutdown timing Please note that the normal software controlled shutdown using AT SMSO will allow option for a fast shutdown by parameter fs...

Page 42: ...e band 2 2 1 Antenna Interface Specifications For approval reasons it is mandatory to connect apply the Rx diversity antenna to an existing antenna Not connecting applying the Rx diversity antenna does not necessarily impact the performance but may result in approval failures The minimum antenna efficiency should be better than 50 1 By delivery default the UMTS LTE Rx diversity antenna is configur...

Page 43: ...3 dBm LTE 1900 Band 2 ch band width 5MHz 1RB position low 21 23 dBm UMTS HSPA connectivity2 Band II IV V Receiver Input Sensitivity ARP UMTS 850 Band V 104 7 110 dBm UMTS AWS Band IV 106 7 108 5 dBm UMTS 1900 Band II 104 7 110 dBm RF Power ARP with 50Ω Load Board temperature 85 C UMTS 850 Band V 21 23 5 dBm UMTS AWS Band IV 21 23 5 dBm UMTS 1900 Band II 21 23 5 dBm 1 No active power reduction is i...

Page 44: ...CB s layer stack Some examples are given in Section 2 2 3 To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the external application PCB it is recommended to realize the antenna con nection line using embedded Stripline rather than Micro Stripline technology Please see Sec tion 2 2 3 1 for examples of how to design the antenna connectio...

Page 45: ...le to calculate line arrangements for specific applications and PCB materials for example from http www polarinstruments com commercial software or from http web awrcorp com Usa Products Optional Products TX Line free software Embedded Stripline This figure below shows a line arrangement example for embedded stripline with 65µm FR4 prepreg type 1080 and 710µm FR4 core 4 layer PCB Figure 21 Embedde...

Page 46: ...icro Stripline This section gives two line arrangement examples for micro stripline Micro Stripline on 1 0mm Standard FR4 2 Layer PCB The following two figures show examples with different values for D1 ground strip separa tion Figure 22 Micro Stripline on 1 0mm standard FR4 2 layer PCB example 1 Antenna line Ground line Ground line Application board ...

Page 47: ...rface Description 2 2 RF Antenna Interface 53 els81 us_hid_v01 004 2017 09 27 Confidential Preliminary Page 47 of 107 Figure 23 Micro Stripline on 1 0mm Standard FR4 PCB example 2 Antenna line Ground line Ground line Application board ...

Page 48: ...09 27 Confidential Preliminary Page 48 of 107 Micro Stripline on 1 5mm Standard FR4 2 Layer PCB The following two figures show examples with different values for D1 ground strip separa tion Figure 24 Micro Stripline on 1 5mm Standard FR4 PCB example 1 Antenna line Ground line Ground line Application board ...

Page 49: ...rface Description 2 2 RF Antenna Interface 53 els81 us_hid_v01 004 2017 09 27 Confidential Preliminary Page 49 of 107 Figure 25 Micro Stripline on 1 5mm Standard FR4 PCB example 2 Antenna line Ground line Ground line Application board ...

Page 50: ...ace to RF Connector Figure 26 shows the connection of the module s antenna pad with an application PCB s coaxial antenna connector Please note that the ELS81 US bottom plane appears mirrored since it is viewed from ELS81 US top side By definition the top of customer s board shall mate with the bottom of the ELS81 US module Figure 26 Routing to application s RF connector top view ...

Page 51: ...ed lines e g RXD0 VDDLP and ON While developing SMT applications it is strongly recommended to provide test points for certain signals i e lines to and from the module for debug and or test purposes The SMT application should allow for an easy access to these signals For details on how to implement test points see 3 The EMC measures are best practice recommendations In fact an adequate EMC strateg...

Page 52: ... for SIM protection against RF internal Antenna 150µF Low ESR 33pF Blocking Blocking Blocking PWR_IND BATT BB 53 204 GPIO20 GPIO23 4 Blocking 100k 4 7k 100k 22k 2 2k 3 USB 150µF Low ESR 33pF GND GND ANT_DRX Diversity antenna ON EMERG_RST RESET VDDLP 100k VDDLP BEAD BEAD It is recommended to add the BEAD as shown to the BATT BB line The purpose of this is to mitigate noise from baseband power suppl...

Page 53: ...ircuit with recommended level shifters for an external application s mi cro controller with VLOGIC between 3 0V 3 6V The level shifters can be used for digital input and output lines with VOHmax 1 85V or VIHmax 1 85V Figure 28 Sample level conversion circuit 5V tolerarant 5V tolerarant Low level input Low level input Low level input VCC 5V tolerant VCC E g 74VHC1GT50 E g NC7WZ16 74LVC2G34 External...

Page 54: ...C Pattern and data transfer rate HSPA DATA HSPA data transfer in progress Power consumption depends on net work settings e g TPC Pattern and data transfer rate LTE DATA LTE data transfer in progress Power consumption depends on network settings e g TPC Pattern and data transfer rate Power Down Normal shutdown after sending the power down command Only a voltage regulator is active for powering the ...

Page 55: ...ill send the URC SYSSTART that notifies the host appli cation that the first AT command can be sent to the module see also 1 3 2 1 1 Connecting ELS81 US BATT Lines Figure 29 shows sample external application circuits that allow to connect and also to tempo rarily disconnect the module s BATT lines from the external application s power supply Figure 29 illustrates the application of power employing...

Page 56: ...2017 09 27 Confidential Preliminary Page 56 of 107 Figure 29 Sample circuit for applying power using an external µC 3 8V Module Place C2 C5 close to module µcontroller ENABLE VBATT VBATT_IN C1 100nF C2 47µF X5R C3 47µF X5R C4 47µF X5R C5 47µF X5R C6 47µF X5R R1 100k R2 100k R3 100k R6 10k T1 T2 IRML6401 BC847 ...

Page 57: ... is recommended to set a serial 1kOhm resistor between the ON circuit and the external ca pacitor or battery at the VDDLP power supply i e RTC backup circuit This serial resistor pro tection is necessary in case the capacitor or battery has low power is empty With Option 2 the typical resistor values are R1 150k and R2 3k But the resistor values depend on the cur rent gain from the employed PNP re...

Page 58: ...n circuit shown in either Figure 32 or Figure 33 is recommended Figure 32 Automatic ON circuit based on voltage detector option 1 BATT ON EMERG_RST V180 VCORE VDDLP Rising edge only starts up the module 100ms Voltage Detector BATT BB GND ON VDDLP GND It is recommended to apply the 3 pin microprocessor reset monitor MAX803SQ293T1G or MAX803SQ293D3T1G manufactured by ON Semiconductor Details please ...

Page 59: ...ware controlled reset by AT CFUN command Starts Normal mode see Section 3 2 2 1 Hardware controlled reset by EMERG_RST line Starts Normal mode see Section 3 2 2 2 3 2 2 1 Restart ELS81 US via AT CFUN Command To reset and restart the ELS81 US module use the command AT CFUN See 1 for details Voltage Detector BATT BB GND ON VDDLP It is recommended to apply the ultra low current voltage detector NCP30...

Page 60: ...the signal level from low to high the module restarts The other signals continue from their reset state as if the module was switched on by the ON signal Figure 34 Emergency restart timing It is recommended to control this EMERG_RST line with an open collector transistor or an open drain field effect transistor Caution Use the EMERG_RST line only when due to serious problems the software is not re...

Page 61: ...on is complet ed as soon as the ASC0 interface lines CTS0 DSR0 and RING0 as well as the ASC1 interface line CTS1 have turned low see Section 2 1 4 and Section 2 1 5 Now the module is ready to receive and transmit data Abbreviations used in above Table 10 Table 10 Signal states Signal name Reset state First start up configuration CCIO L O L CCRST L O L CCCLK L O L CCIN T 100k PD I PD RXD0 T PU O H ...

Page 62: ...S is to issue the appropriate AT com mand This procedure lets ELS81 US log off from the network and allows the software to enter into a secure state and safe data before disconnecting the power supply The mode is referred to as Power Down mode In this mode only the RTC stays active After sending the switch off command AT SMSO be sure not to enter any further AT commands until the module was re sta...

Page 63: ...ace Description 3 2 Power Up Power Down Scenarios 77 els81 us_hid_v01 004 2017 09 27 Confidential Preliminary Page 63 of 107 Figure 35 Switch off behavior BATT VCORE V180 VDDLP AT SMSO System power down procedure Power down EMERG_RST ON ...

Page 64: ...ing the module from exposure to extreme conditions The presentation of the URCs depends on the settings selected with the AT SCTM write command for details see 1 AT SCTM 1 Presentation of URCs is always enabled AT SCTM 0 default Presentation of URCs is enabled during the 2 minute guard period after start up of ELS81 US After expiry of the 2 minute guard period the presentation of URCs will be disa...

Page 65: ... threshold is calculated for max 400mV voltage drops during transmit burst Power supply sources for external applications should be designed to tolerate 400mV voltage drops without crossing the lower limit of 3 0 V For external applications oper ating at the limit of the allowed tolerance the default undervoltage threshold may be adapted by subtracting an offset For details see 1 AT SCFG MEShutdow...

Page 66: ... at all or the USB host must bring its USB interface into Suspend state Also VUSB_IN should always be kept enabled for this functionality See Universal Serial Bus Specification Revision 2 0 1 for a description of the Suspend state 3 3 1 Power Saving while Attached to WCDMA Networks The power saving possibilities while attached to a WCDMA network depend on the paging tim ing cycle of the base stati...

Page 67: ... a power saving period varies It may be calculated using the following formula t DRX Cycle Value 10 ms DRX cycle value in LTE networks is any of the four values 32 64 128 and 256 thus resulting in power saving intervals between 0 32 and 2 56 seconds The DRX cycle value of the base station is assigned by the LTE network operator In the pauses between listening to paging messages the module resumes ...

Page 68: ...ent thus allowing an external application to almost immediately terminate power saving After RTS0 assertion the CTS0 line signals module wake up i e readiness of the AT command interface It is therefore recommended to enable RTS CTS flow control default setting Figure 38 shows the described RTS0 wake up mechanism Figure 38 Wake up via RTS0 R T S 0 C T S 0 T X D 0 R X D 0 A T c o m m a n d R e p ly...

Page 69: ...or supplying power to the device are handled by the power management section of the analog controller This IC provides the following features Stabilizes the supply voltages for the baseband using low drop linear voltage regulators and a DC DC step down switching regulator Switches the module s power voltages for the power up and down procedures SIM switch to provide SIM power supply 3 4 1 Power Su...

Page 70: ... OFF State supply current Power Down µA Average UMTS supply current Data transfer maximum Pout SLEEP2 DRX 9 UART deactivated USB disconnected mA USB suspended mA SLEEP2 DRX 8 UART deactivated USB disconnected mA USB suspended mA SLEEP2 DRX 6 UART deactivated USB disconnected mA USB suspended mA IDLE3 DRX 6 UART active but no communication USB disconnected mA USB active mA UMTS Data transfer Band I...

Page 71: ...ransfer Band 4 mA LTE4 Data transfer Band 5 mA LTE4 Data transfer Band 12 mA 1 With an impedance of ZLOAD 50Ω at the antenna connector Measured at 25 C at 3 8V except for Power Down ratings that were measured at 3 0V 2 Measurements start 6 minutes after switching ON the module Averaging times SLEEP mode 3 minutes transfer modes 1 5 minutes Communication tester settings no neighbour cells no cell r...

Page 72: ...Power Supply by AT Command To monitor the supply voltage you can also use the AT SBV command which returns the value related to the reference points BATT and GND The module continuously measures the voltage at intervals depending on the operating mode of the RF interface The duration of measuring ranges from 0 5 seconds in TALK DATA mode to 50 seconds when ELS81 US is in IDLE mode or Limited Servi...

Page 73: ... a great extent depending on operating mode used frequency band radio output power and cur rent supply voltage For more information regarding the module s thermal behavior please refer to 4 Table 14 Board temperature Parameter Min Typ Max Unit Normal operation 30 25 85 C Extended operation1 1 Extended operation allows normal mode speech calls or data transmission for limited time until automatic t...

Page 74: ...platform is grounded over external devices like a computer or other equipment such as the Gemalto reference application described in Chapter 5 3 6 1 ESD Protection for Antenna Interfaces The following Figure 40 shows how to implement an external ESD protection for the RF anten na interfaces ANT_MAIN and ANT_DRX with either a T pad or PI pad attenuator circuit for RF line routing design see also Se...

Page 75: ...nts of EMI measures A E that may be implemented between module and external application depending on the signal line see Figure 41 and Table 16 Pay attention not to exceed the maximum input voltages and prevent voltage overshots if using in ductive EMC measures The maximum value of the serial resistor should be lower than 1kΩ on the signal line The max imum value of the capacitor should be lower t...

Page 76: ...x x RTS0 x x x x x GPIO1 DTR0 x x x x x GPIO2 DCD0 x x x x x GPIO3 DSR0 SPI_CLK x x x x x GPIO4 FST_SHDN x x x x x GPIO5 LED x x x x x GPIO6 PWM2 x x x x x GPIO7 PWM1 x x x x x GPIO8 COUNTER x x x x x GPIO11 GPIO15 x x x x x GPIO16 RXD1 MOSI x x x x x GPIO17 TXD1 MISO x x x x x GPIO18 RTS1 x x x x x GPIO19 CTS1 SPI_CS x x x x x GPIO20 x x x x x GPIO21 x x x x x GPIO22 x x x x x GPIO23 x x x x x GP...

Page 77: ...ge 20 500Hz the Standard s acceleration reference value was increased to 20g Shock half sinus Acceleration 500g Shock duration 1ms 1 shock per axis 6 positions x y and z DIN IEC 60068 2 27 Dry heat Temperature 70 2 C Test duration 16h Humidity in the test chamber 50 EN 60068 2 2 Bb ETS 300 019 2 7 Temperature change shock Low temperature 40 C 2 C High temperature 85 C 2 C Changeover time 30s dual ...

Page 78: ...ential Preliminary Page 78 of 107 4 Mechanical Dimensions Mounting and Packaging 4 1 Mechanical Dimensions of ELS81 US Figure 42 shows the top and bottom view of ELS81 US and provides an overview of the board s mechanical dimensions For further details see Figure 43 Figure 42 ELS81 US top and bottom view Product label Top view Bottom view ...

Page 79: ...on ELS81 US Hardware Interface Description 4 1 Mechanical Dimensions of ELS81 US 92 els81 us_hid_v01 004 2017 09 27 Confidential Preliminary Page 79 of 107 Figure 43 Dimensions of ELS81 US all dimensions in mm ...

Page 80: ...ottom side of the module it is recommended not to route the signal tracks on the top layer of an external PCB directly under the module or at least to ensure that signal track routes are sufficiently covered with solder resist 4 2 1 SMT PCB Assembly 4 2 1 1 Land Pattern and Stencil The land pattern and stencil design as shown below is based on Gemalto characterizations for lead free solder paste o...

Page 81: ...nary Page 81 of 107 The central ground pads are primarily intended for stabilizing purposes and may show some more voids than the application interface pads at the module s rim This is acceptable since they are electrically irrelevant Figure 45 Recommended design for 110µm thick stencil top view Figure 46 Recommended design for 150µm thick stencil top view ...

Page 82: ...ign and reflow profile into account For land and stencil pattern design recommendations see also Section 4 2 1 1 Optimizing the solder stencil pattern design and print process is necessary to ensure print uniformity to decrease sol der voids and to increase board level reliability Daisy chain modules for SMT characterization are available on request For details refer to 3 Generally solder paste ma...

Page 83: ...S81 US onto the Application Platform 92 els81 us_hid_v01 004 2017 09 27 Confidential Preliminary Page 83 of 107 4 2 3 Soldering Conditions and Temperature 4 2 3 1 Reflow Profile Figure 47 Reflow Profile TL TP tP tL tS Preheat t to maximum Time Temperature TSmin TSmax ...

Page 84: ...ication the module will very likely be destroyed and cannot be soldered onto another appli cation Table 18 Reflow temperature ratings1 1 Please note that the reflow profile features and ratings listed above are based on the joint industry standard IPC JEDEC J STD 020D 1 and are as such meant as a general guideline For more information on reflow profiles and their optimization please refer to 3 Pro...

Page 85: ...age conditions Type Condition Unit Reference Air temperature Low High 25 40 C IPC JEDEC J STD 033A Humidity relative Low High 10 90 at 40 C IPC JEDEC J STD 033A Air pressure Low High 70 106 kPa IEC TR 60271 3 1 1K4 IEC TR 60271 3 1 1K4 Movement of surrounding air 1 0 m s IEC TR 60271 3 1 1K4 Water rain dripping icing and frosting Not allowed Radiation Solar Heat 1120 600 W m2 ETS 300 019 2 1 T1 2 ...

Page 86: ...ed to each MBB see Figure 52 for details It is not necessary to bake ELS81 US if the conditions specified in Section 4 2 4 1 and Sec tion 4 2 4 2 were not exceeded It is necessary to bake ELS81 US if any condition specified in Section 4 2 4 1 and Section 4 2 4 2 was exceeded If baking is necessary the modules must be put into trays that can be baked to at least 125 C Devices should not be baked in...

Page 87: ...ed in Figure 48 The figure also shows the proper part orientation The tape width is 44mm and the ELS81 US modules are placed on the tape with a 32 mm pitch The reels are 330mm in diameter with a core diameter of 100mm Each reel contains 500 modules 4 3 1 1 Orientation Figure 48 Carrier tape Figure 49 Reel direction 44mm 330mm Reel direction of the completely equipped tape Direction into SMD machin...

Page 88: ...ckaging 92 els81 us_hid_v01 004 2017 09 27 Confidential Preliminary Page 88 of 107 4 3 1 2 Barcode Label A barcode label provides detailed information on the tape and its contents It is attached to the reel Figure 50 Barcode label on tape reel Barcode label ...

Page 89: ...g The tape reels are stored inside a moisture barrier bag MBB together with a humidity indica tor card and desiccant pouches see Figure 51 The bag is ESD protected and delimits mois ture transmission It is vacuum sealed and should be handled carefully to avoid puncturing or tearing The bag protects the ELS81 US modules from moisture exposure It should not be opened until the devices are ready to b...

Page 90: ...Cinterion ELS81 US Hardware Interface Description 4 3 Packaging 92 els81 us_hid_v01 004 2017 09 27 Confidential Preliminary Page 90 of 107 Figure 52 Moisture Sensitivity Label ...

Page 91: ... once removed from the MBB The humidity indicator card is a moisture indicator and is included in the MBB to show the ap proximate relative humidity level within the bag Sample humidity cards are shown in Figure 53 If the components have been exposed to moisture above the recommended limits the units will have to be rebaked Figure 53 Humidity Indicator Card HIC A baking is required if the humidity...

Page 92: ...gure 54 The small quantity trays are an alterna tive to the single feed tape carriers normally used However the trays are not designed for ma chine processing They contain modules to be hand soldered onto an external application for information on hand soldering see 3 Trays are packed and shipped in the same way as tape carriers including a moisture barrier bag with desiccant and humidity indicato...

Page 93: ...labeled with the CE conformity mark 2002 95 EC RoHS 1 2011 65 EC RoHS 2 Directive of the European Parliament and of the Council of 27 January 2003 and revised on 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment RoHS Table 21 Standards of North American type approval CFR Title 47 Code of Federal Regulations Part 22 and Part 24 Telecomm...

Page 94: ...al requirements of article 3 2 of the Directive 2014 53 EU Part 13 Evolved Universal Terrestrial Radio Access E UTRA User Equipment UE EN 60950 1 2006 A11 2009 A1 2010 A 12 2011 A2 2013 Safety of information technology equipment Table 23 Requirements of quality IEC 60068 Environmental testing DIN EN 60529 IP codes Table 24 Standards of the Ministry of Information Industry of the People s Republic ...

Page 95: ... Hardware Interface Description 5 1 Directives and Standards 99 els81 us_hid_v01 004 2017 09 27 Confidential Preliminary Page 95 of 107 Table 25 Toxic or hazardous substances or elements with defined concentration limits ...

Page 96: ...r or not further standards recommendations or directives are in force outside these areas Products intended for sale on US markets ES 59005 ANSI C95 1 Considerations for evaluation of human exposure to Electromagnetic Fields EMFs from Mobile Telecommunication Equipment MTE in the frequency range 30MHz 6GHz Please note that SAR requirements are specific only for portable devices and not for mobile ...

Page 97: ...attached 6dB coaxial attenuator is cho sen to connect the evaluation module directly to the UMTS test equipment instead of employing the SMA antenna connectors on the ELS81 US DSB75 adapter as shown in Figure 55 The following products are recommended Hirose SMA Jack U FL Plug conversion adapter HRMJ U FLP 40 for details see http www hirose connectors com or http www farnell com Aeroflex Weinschel ...

Page 98: ... modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable mobile This is mandatory to meet the SAR requirements for por table mobiles see Section 5 2 for detail Changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate the equ...

Page 99: ...ux conditions suivantes 1 cet appareil ne doit pas causer d interférence et 2 cet appareil doit accepter toute interférence notamment les interférences qui peuvent affecter son fonctionnement EN Radio frequency RF Exposure Information The radiated output power of the Wireless Device is below the Industry Canada IC radio fre quency exposure limits The Wireless Device should be used in such a manner...

Page 100: ...il 27 2000 6 3 Terms and Abbreviations Chapter What is new Initial document setup Abbreviation Description ADC Analog to digital converter AGC Automatic Gain Control ANSI American National Standards Institute ARFCN Absolute Radio Frequency Channel Number ARP Antenna Reference Point ASC0 ASC1 Asynchronous Controller Abbreviations used for first and second serial interface of ELS81 US B Thermistor C...

Page 101: ...l Rate EIRP Equivalent Isotropic Radiated Power EMC Electromagnetic Compatibility ERP Effective Radiated Power ESD Electrostatic Discharge ETS European Telecommunication Standard ETSI European Telecommunication Standards Institute FCC Federal Communications Commission U S FDMA Frequency Division Multiple Access FR Full Rate GMSK Gaussian Minimum Shift Keying GPIO General Purpose Input Output HiZ H...

Page 102: ...d Loop PPP Point to point protocol PSK Phase Shift Keying PSU Power Supply Unit PWM Pulse Width Modulation R TTE Radio and Telecommunication Terminal Equipment RAM Random Access Memory RF Radio Frequency RLS Radio Link Stability RMS Root Mean Square value RoHS Restriction of the use of certain hazardous substances in electrical and electronic equipment ROM Read only Memory RTC Real Time Clock RTS ...

Page 103: ...minary Page 103 of 107 TDMA Time Division Multiple Access TE Terminal Equipment also referred to as DTE TLS Transport Layer Security Tx Transmit Direction UART Universal asynchronous receiver transmitter URC Unsolicited Result Code USSD Unstructured Supplementary Service Data VSWR Voltage Standing Wave Ratio Abbreviation Description ...

Page 104: ...the suspension or denial of cellular services to the offender legal action or both Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes Switch off the cellular terminal when you are near petrol stations fuel depots chemical plants or where blasting operations are in progress Operation of any elec trical equipment in potentially explosive atmospheres can consti...

Page 105: ...module s shielding or be printed on a label adhered to the module s shielding ELS81 US Evaluation Mod ule Gemalto M2M Ordering number TBD DSB75 Evaluation Kit Gemalto M2M Ordering number L36880 N8811 A100 DSB Mini Compact Evaluation Board Gemalto M2M Ordering number L30960 N0030 A100 Starter Kit B80 Gemalto M2M Ordering Number L30960 N0040 A100 Multi Adapter R1 for mount ing ELS81 US evaluation mo...

Page 106: ... 49 6227 3091 0 Fax 49 6227 3091 8100 Email mxgermany molex com American Headquarters Lisle Illinois 60532 U S A Phone 1 800 78MOLEX Fax 1 630 969 1352 Molex China Distributors Beijing Room 1311 Tower B COFCO Plaza No 8 Jian Guo Men Nei Street 100005 Beijing P R China Phone 86 10 6526 9628 Fax 86 10 6526 9730 Molex Singapore Pte Ltd 110 International Road Jurong Town Singapore 629174 Phone 65 6 26...

Page 107: ...entity modules security solutions and licensing and monetization solutions to streamline development timelines and provide cost efficiencies that improve the bottom line As an experienced software provider we help customers manage connectivity security and quality of service for the long lifecycle of IoT solutions For more information please visit www gemalto com m2m www facebook com gemalto or Fo...

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