3
■
Notes for Designing the MCU Foot Pattern
Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the printed cir-
cuit board of the user system.
The printed circuit board of the user system must be designed with due consideration given to this
footprint as well as to the mass production MCU.
For more information, contact the Tokyo Eletech Corporation.
Figure 2 Foot pattern dimensions for mounting the NQPACK
*1 : Positions of the guide pin holes (
φ
1.0) when mounting the NQPACK. These holes do not need to be fab-
ricated if the guide pins are not used.
*2 : Position of the hole (
φ
3
.2) for the screw for affixing the IC socket when the NQPACK176SD-SL (Tokyo
Eletech Corporation, sold separately) is mounted instead of the NQPACK176SD. This hole does not
need to be fabricated if the NQPACK176SD-SL is not used.
0.5mm
×
4
3
= 21.5mm
0.5mm
10.0mm
0.25mm
10.0mm
φ
3
.2mm SL-type*
2
3
-
φ
1.0mm *
1
2
3
.1mm
Pin 1
27.1mm
2.0mm
2.0mm
Summary of Contents for LQFP-176P
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