Fujitsu ETERNUS AF S3 Series, Design Manual

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■
User Expansion
Customers can expand (add) the following components.
To add components that are not described in this section, contact your sales representative or maintenance
engineer.
•
SSD
•
Long wave SFP+ modules (16Gbit/s)
ETERNUS AF250 S3
The table below shows whether hot swap or hot expansion for components of the ETERNUS AF250 S3 is possible.
Table 72 Hot Swap and Hot Expansion Availability for Components (ETERNUS AF250 S3)
Component Hot swap Hot expansion Remarks
Controller enclosure (CE)
´
— Replace the controller enclosure (CE)
when the MP (*1) fails.
Controller module (CM)
¡
(*2) — —
System memory
¡
(*2) — —
BBU ¡ (*2) — —
BUD
¡ (*2)
— —
Controller firmware
¡
(*2) (*3) — —
Host interface (FC-CA)
¡
(*2)
¡
(*2) —
Host interface (10G iSCSI-CA) ¡ (*2) ¡ (*2) —
Power supply unit (PSU)
¡
— —
SSD ¡ ¡ —
Operation panel (PANEL) ´ (*4) — —
Disk firmware
¡
(*3) — —
Drive enclosure (DE) ¡ ¡ Replace the drive enclosure (DE)
when the MP (*1) fails.
Power supply unit (PSU) ¡ — —
SSD
¡ ¡
—
Operation panel (PANEL)
´
(*4) — —
I/O module (IOM)
¡
— —
Disk firmware ¡ (*3) — —
¡
: Allowed /
´
: Not allowed (cold swap is possible) / —: Not applicable
*1: Mid Plane. This is a board that is located between the front (drive side) and rear (controller (CM) or I/O module (IOM) side) of the
ETERNUS AF.
*2: All of the host interfaces on the CM that will have maintenance or expansion performed go offline. When a multipath configuration is
used, switch to the host paths of the CM that will not have maintenance performed to continue operation.
*3: Depending on the changes in the firmware, this function may require I/Os to be temporarily stopped.
*4: Operation can be continued during a failure. The status of the ETERNUS AF can be monitored via ETERNUS Web GUI or ETERNUS CLI.
5. Maintenance/Expansion
Hot Swap/Hot Expansion
187 Design Guide