USB-KW019032 Freescale USB Dongle Development Board , User’s Guide, Rev. 0, 10/2015
24
Freescale Semiconductor, Inc.
PCB manufacturing specifications
NOTE
•
The complete set of design files for the USB-KW019032 development
platform is available at
www.freescale.com/KW01
, under “Software
and Tools.” These reference designs can be used as a starting point for
developing custom applications.
•
The
Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout
Considerations Reference Manual
(document
ZHDCRM
) is also
available at
www.freescale.com/KW01
for additional design guidance.
•
See
Hardware Design Considerations for MC12311 and MKW01x
Sub-GHz Devices
(document
AN4958
) for additional design guidance.
5.1
Single PCB construction
This section describes individual PCB construction details.
•
The USB-KW019032 PCBs are four-layer designs
•
The PCBs contain no blind, buried, or micro vias
•
The PCB data are as follows:
— The size of USB-KW019032 is approximately 18.5 × 61.4 mm (0.73 × 2.42 inches)
— The final thickness of USB-KW019032 (Cu/Cu) is 1.57 mm (0.62 inches) ±10% (excluding
solder mask)
Table 6
defines the layers of the PCB. The artwork identification refers to the name of the layer in
commonly used terms.
Table 6. USB-KW019032 layer by layer overview
Layer
Artwork identification
File name
1
Silkscreen top
PSS.art
2
Top layer metal
L1_PS.art
3
Ground layer
L2_GND.art
4
Signal layer
L3_INT_1.art
5
Bottom layer metal
L4_SS.art
6
Silkscreen bottom
SSS.art
