Hardware Description
KT912F634UG User’s Guide Rev. 2.0 10/2013
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Freescale Semiconductor, Inc.
Archive Information
Archive Information
7
Hardware Description
7.1
Board Description
Figure 3
is a snapshot of the EVM with key component and connector locations. The following list corresponds
with the numbers listed on the picture.
1. LEDs to indicate of HS and LS switching
2. Input power connectors
3. Prototype area
4. TBDML interface
5. LIN connector
6. Wake-up button
7. Reset button
8. BDM connector for external programming/debugging BDM interface
9. MM912F634CV1AE
The board is protected against reverse battery voltage by diode D10, which can withstand up to 3.0 A
continuous current. The board operation is straightforward, as is the TDBML interface. (See section “
TBDML
”
on page 9), the board contains the passive components required for proper operation of the MM912F634.
Connectors provide access to all device pins and test points for important signals.
There are fifteen jumpers on the board. Power to the LEDs is provided through jumpers JP4, JP8, JP10, JP11,
JP12, and JP13. Removing these jumpers allows low power mode current consumption to be demonstrated.
JP6 supplies power to zener diode D11.
Two push buttons are included: SW1 resets the MCU, and SW2 allows wake-up from one of the low power
modes.
A small prototype area allows fast connection of additional components. Key power and ground vias are located
around the prototype area.
The EVM has three different grounds: LIN ground, main supply ground (also referred to as GND), and analog
ground. All grounds are connected together at a single point on the board, located under the MM912F634. The
bottom copper layer of the EVM and copper areas on the top surface are both assigned to GND.
Figure 3. Evaluation Module Board
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