i.MX 6UltraLite EVK Board Hardware User’s Guide, Rev. 1, 03/2016
Freescale Semiconductor, Inc.
19
PCB information
3
PCB information
Both the base board and main board are made using standard 4-layer technology. The material used was
FR-4.
The PCB stack-up information is shown in the following table.
Table 7. Board stack-up information
Base board
Main board
Layer
Description
Copper
(Oz)
Dielectric
Thickness
(mil)
Layer
Description
Copper
(Oz)
Dielectric
Thickness
(mil)
1
Signal
1
—
1
Signal
1
—
Dielectric
—
3.0
Dielectric
—
3
2
GND
1
—
2
GND
1
—
Dielectric
—
36
Dielectric
—
28
3
Power
1
—
3
Power
1
—
Dielectric
—
3.0
Dielectric
—
3
4
Signal
1
—
4
Signal
1
—