MMA8452Q
Sensors
44
Freescale Semiconductor, Inc.
Figure 14. Footprint
7.2
Overview of Soldering Considerations
Information provided here is based on experiments executed on QFN devices. These experiments cannot represent exact
conditions present at a customer site. Therefore, information herein should be used for guidance only. Process and design
optimizations are recommended to develop an application-specific solution. With the proper PCB footprint and solder stencil
designs, the package will self-align during the solder reflow process.
•
Stencil thickness is 100 or 125
μ
m.
•
The PCB should be rated for the multiple lead-free reflow condition with a maximum 260 °C temperature.
•
Use a standard pick-and-place process and equipment. Do not use a hand soldering process.
•
Do not use a screw-down or stacking to mount the PCB into an enclosure. These methods could bend the PCB, which
would put stress on the package.
7.3
Halogen Content
This package is designed to be Halogen Free, exceeding most industry and customer standards. Halogen Free means that
no homogeneous material within the assembled package will contain chlorine (Cl) in excess of 700 ppm or 0.07% weight/weight
or bromine (Br) in excess of 900 ppm or 0.09% weight/weight.
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