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e200z3 Power Architecture Core Reference Manual, Rev. 2
Freescale Semiconductor
7-1
Chapter 7
External Core Complex Interfaces
This chapter describes the external interfaces of the e200z3 core complex. Signal descriptions as well as
data transfer protocols are documented in the following subsections.
Section 7.4, “Internal Signals,”
describes a number of internal signals that are not directly accessible to
users, but they are mentioned in various chapters in this manual and aid in understanding the behavior of
the core.
7.1
Overview
The external interfaces encompass the following:
•
Control and data signals supporting instruction and data transfers
•
Support for interrupts, including vectored interrupt logic
•
Reset support
•
Power management interface signals
•
Debug event signals
•
Time base control and status information
•
Processor state information
•
Nexus 1/3/OnCE/JTAG interface signals
•
A test interface
The memory interface that the BIU supports is based on the AMBA AHB-Lite subset of the AMBA 2.0
AHB, with V6 AMBA extensions. (Ref. documents ARM IHI 0011A, ARM DVI 0044A, and ARM
PR022-GENC-001011 0.4). Sideband signals, described in this chapter, support additional control
functions. A 64-bit data bus is implemented. The pipelined memory interface supports read and write
transfers of 8, 16, 24, 32, and 64 bits, misaligned transfers, burst transfers of four double words, and true
big- and little-endian operation.
NOTE
The AMBA AHB bit and byte ordering reflect a natural little-endian
ordering that AMBA documentation uses. The BIU automatically performs
byte lane conversions to support big-endian transfers. Memories and
peripheral devices/interfaces should be wired according to byte lane
addresses defined in
Single-beat and misaligned transfers are supported for cache-inhibited read and write cycles, and
write-buffer writes. Burst transfers (double-word–aligned) of 4 double words are supported for cache
line-fill and copyback operations.