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L811-EB Hardware User Manual Page 45 of 47

5.5

Storage

5.5.1

Storage Life

Storage Conditions (recommended): Temperature is 23 ± 5 ℃, relative humidity is RH 35-70%.

Storage period (sealed vacuum packing): Under the recommended storage conditions, the storage life is

12 months.

5.5.2

Workshop Life

The workshop life for “Class 3” humidity-sensitive products is 72 hours. After unpacking and under the

environment with the room temperature of 23±5

℃

and the relative humidity of less than 60%, the reflow

production or other high-temperature operations shall be conducted within 72 hours for products, or

products shall be stored in the environment with the relative humidity of less than 10%, in order to keep

products dry.

5.5.3

Recommended baking standards:



Continuous baking time: 9 hours.



Temperature: 125±5

℃



Oven: Heat convection oven.

5.6

Packing

The L811-EB module uses the tray sealed vacuum packing, combined with the outer packing method

using the hard cartoon box, so that the storage, transportation and the usage of modules can be protected

to the greatest extent.

Note:

The vacuum package bag includes the humidity card and a desiccant. The module is the humidity

sensitive device, and the humidity sensitivity level is Class 3, which meets the requirements of the

American Electronic Component Industry Association (JEDEC). Please read the relevant

application guidance and precautions referred to herein, to avoid the permanent damage to the

product caused by humidity.

Summary of Contents for L811-EB

Page 1: ...L811 EB Hardware User Manual Version 1 0 2 Update date 2017 06 15 ...

Page 2: ...Reproduction forbidden without Fibocom Wireless Inc written authorization All Rights Reserved L811 EB Hardware User Manual Page 2 of 47 Applicability Table No Product model Description 1 L811 EB 00 NA ...

Page 3: ...t in any form Notice The document is subject to update from time to time owing to the product version upgrade or other reasons Unless otherwise specified the document only serves as the user guide All the statements information and suggestions contained in the document do not constitute any explicit or implicit guarantee Version Record Version Update Date Description V1 0 0 2017 03 16 Initial rele...

Page 4: ... 3 1 1 Pin Distribution 11 3 1 2 Pin Definition 12 3 2 Power Supply 18 3 2 1 Power Supply 19 3 2 2 RTC Power Supply 20 3 2 3 1 8V Power Supply 21 3 2 4 Power Consumption 21 3 3 Control Signal 23 3 3 1 Module Start Up 23 3 3 1 1 Start up Circuit 23 3 3 1 2 Start up Timing Sequence 23 3 3 2 Module Shutdown 24 3 3 2 1 Software Shutdown 24 3 3 2 2 Hardware Shutdown 25 3 3 3 Module Reset 25 3 4 USB Int...

Page 5: ...OST 33 3 7 4 PA_BLANKING 33 3 8 Interrupt Control 34 3 8 1 WAKEUP 34 3 8 2 W_DISABLE 35 3 8 3 BODY_SAR 35 3 9 Digital Audio 35 3 9 1 I2S Mode 36 3 9 2 PCM Mode 36 3 10 I2C Interface Description 37 3 11 Clock Interface 38 3 12 ADC Interface 38 3 13 Other Interfaces 38 4 RF Interface 39 4 1 Operating Band 39 4 2 Transmitting Power 39 4 3 Receiver Sensitivity 40 4 4 RF PCB Design 41 4 4 1 Trace Routi...

Page 6: ...n All Rights Reserved L811 EB Hardware User Manual Page 6 of 47 5 3 Recommended Design for PCB Bonding Pad 44 5 4 SMT 44 5 5 Storage 45 5 5 1 Storage Life 45 5 5 2 Workshop Life 45 5 5 3 Recommended baking standards 45 5 6 Packing 45 5 6 1 Tray Package 46 5 6 2 Tray size 47 ...

Page 7: ... Equipment UE conformance specification Radio transmission and reception Part 1 Conformance testing 3GPP TS 21 111 V10 0 0 USIM and IC card requirements 3GPP TS 51 011 V4 15 0 Specification of the Subscriber Identity Module Mobile Equipment SIM ME interface 3GPP TS 31 102 V10 11 0 Characteristics of the Universal Subscriber Identity Module USIM application 3GPP TS 31 11 V10 16 0 Universal Subscrib...

Page 8: ...GSM GPRS EDGE 850 900 1800 1900MHz Data Transmission LTE FDD 150Mbps DL 50Mbps UL Cat 4 UMTS HSPA UMTS 384 kbps DL 384 kbps UL DC HSDPA 42Mbps DL Cat 24 5 76Mbps UL Cat6 GPRS EDGE GPRS 107kbps DL 85 6kbps UL multi slot class 33 EDGE E GPRS 296kbps DL 236 8kbps UL multi slot class 33 Power Supply DC 3 3V 4 4V Typical 3 8V Temperature Normal Operating temperature 30 C 75 C Extreme Operating temperat...

Page 9: ... and 27 005 and proprietary FIBOCOM AT commands Firmware update USB Note The RF performance of the module may be slightly beyond the 3GPP specifications when the temperature exceeds the normal operating temperature range of 30 C 75 C 2 3 Application Framework The peripheral applications for L811 EB module are shown in Figure 2 1 Module SIM USB Power Supply VRTC VSD2_1V8 ON OFF RESET Control EINT I...

Page 10: ...rnal LPDDR2 RAM and NAND Application interface RF contains the followings RF Transceiver RF Power PA RF Front end RF Filter Antenna VBAT POWER_ON OFF RESET_N VRTC 1V8 USB2 0 USIM UART EINT INDICATOR I2S I2C CLOCK ADC JTAG MIPI HSIC Tunable ANT Main ANT Diversity ANT Baseband GSM UMTS LTE FDD controller PMU TX LPDDR2 RAM NAND Div RF Front END Main RF Front END PA DCDC PA RF Transceiver RX RX RF Par...

Page 11: ...ithout Fibocom Wireless Inc written authorization All Rights Reserved L811 EB Hardware User Manual Page 11 of 47 3 1 1 Pin Distribution Figure 3 1 Pin Distribution Note Pin NB represents No ball namely no pin at this position ...

Page 12: ...ock 1 8V 3 0V G15 SIM1_DATA IO L USIM data internal pull up 4 7KΩ 1 8V 3 0V H15 SIM1_CD I T USIM detect pull up 390KΩ High active 1 8V F14 SIM1_DP IO PD USB data plus for USIM card not support now G14 SIM1_DN IO PD USB data minus for USIM card not support now UART1 A9 UART1_TXD O PU UART1 transmit Data CMOS 1 8V A10 UART1_RXD I PD UART1 receive Data CMOS 1 8V K14 UART1_RTS O PU UART1 Request To Se...

Page 13: ...data CMOS 1 8V N11 I2S2_RX I PD I2S receive data CMOS 1 8V N12 I2S2_CLK O PD I2S serial clock CMOS 1 8V I2C M11 I2C_SDA IO PU I2C serial data pull up 4 7KΩ CMOS 1 8V M12 I2C_SCL O PU I2C serial clock pull up 4 7KΩ CMOS 1 8V Clock A3 FSYS2_26M O L 26MHz clock output 1 8V 1 8V A8 CLK32K O PD 32kHz clock output 1 8V 1 8V ADC C10 ADC I General purpose A D 1 2V max voltage ANT J1 ANT_MAIN IO Main anten...

Page 14: ...S 1 8V NC D13 NC Not connected E13 NC Not connected D14 NC Not connected E14 NC Not connected B13 NC Not connected C13 NC Not connected B14 NC Not connected C14 NC Not connected JTAG L5 TDO O T Serial Data Out M10 TDI I PU Serial Data Input M7 TMS I PU State machine control signal M9 TCK I PD JTAG clock input M5 TRST_N I PD Reset Module enable M6 TRIG_IN I PD Monitoring Signal Input CMOS 1 8V MIPI...

Page 15: ...Power input Power supply N4 VBAT PI Power input Power supply M3 VBAT PI Power input Power supply M4 VBAT PI Power input Power supply N5 VRTC PO VRTC power supply Power supply N6 VSD2_1V8 PO 1 8V Power supply Power supply B8 GND GND Power supply B9 GND GND Power supply B10 GND GND Power supply B11 GND GND Power supply C11 GND GND Power supply F13 GND GND Power supply L12 GND GND Power supply M13 GN...

Page 16: ... Power supply C9 GND GND Power supply C15 GND GND Power supply D1 GND GND Power supply D2 GND GND Power supply D3 GND GND Power supply D4 GND GND Power supply D12 GND GND Power supply E2 GND GND Power supply E3 GND GND Power supply F1 GND GND Power supply F2 GND GND Power supply F3 GND GND Power supply G1 GND GND Power supply G2 GND GND Power supply G3 GND GND Power supply H1 GND GND Power supply ...

Page 17: ... GND Power supply L3 GND GND Power supply L4 GND GND Power supply L8 GND GND Power supply M2 GND GND Power supply M8 GND GND Power supply M14 GND GND Power supply N13 GND GND Power supply A1 GND GND Power supply A15 GND GND Power supply N1 GND GND Power supply N15 GND GND Power supply TG1 GND Thermal Ground TG2 GND Thermal Ground TG3 GND Thermal Ground TG4 GND Thermal Ground TG5 GND Thermal Ground...

Page 18: ...igh Voltage Level L Low Voltage Level PD Pull Down PU Pull Up T Tristate OD Open Drain PP Push Pull Note The unused pins can be left floating 3 2 Power Supply The power interface of L811 EB module as shown in the following table Pin Pin Name I O Pin Description DC Parameter V Minimum Value Typical Value Maximum Value N3 N4 M3 M4 VBAT PI Power input 3 3 3 8 4 4 A11 VBUS PI USB power supply 2 0 3 8 ...

Page 19: ...capacitor of no less than 440uF The capacitor for battery power supply can be reduced to 100 220uF 1uF 100nF Digital signal noise Filter out the interference generated from the clock and digital signals 39pF 33pF 700 850 900 MHz frequency band Filter out low frequency band RF interference 18pF 8 2pF 6 8pF 1700 1800 1900 2100 2500 2600MHz frequency band Filter out medium high frequency band RF inte...

Page 20: ...ameters are as follows Parameters Minimum Value Typical Value Maximum Value Unit VRTC output voltage 1 71 1 8 1 89 V VRTC input voltage normal clock 1 0 1 8 1 89 V VRTC input current normal clock 10 20 uA The reference design circuit for VRTC as the backup power supply for RTC is shown in Figure 3 4 Figure3 4 VRTC Reference Design Circuit Instructions for VRTC which works as the backup power suppl...

Page 21: ...tal circuits in the module and the voltage is the logical voltage level for the module which can be used to indicate the start up status of the module and can also be used for circuit application of external low current 50mA and can be left floating if not used The definition for the logical voltage level of VSD2_1V8 is as follows Parameters Minimum Value Typical Value Maximum Value Unit VSD2_1V8 ...

Page 22: ...S1800 PCL 0 1Rx 4Tx 450 GPRS Data transfer DCS1900 PCL 0 1Rx 4Tx 465 IEGPRS RMS MCS9 EDGE EDGE Data transfer GSM850 PCL 8 1Rx 4Tx 385 EDGE Data transfer GSM900 PCL 8 1Rx 4Tx 420 EDGE Data transfer DCS1800 PCL 2 1Rx 4Tx 405 EDGE Data transfer DCS1900 PCL 2 1Rx 4Tx 400 IWCDMA RMS WCDMA WCDMA Data transfer Band I 23 5dBm 550 WCDMA Data transfer Band V 23 5dBm 480 WCDMA Data transfer Band VIII 23 5dBm...

Page 23: ...V N7 RESET_N I Reset signal with 100KΩ internal pull up active low 1 8V 3 3 1 Module Start Up 3 3 1 1 Start up Circuit The VRTC output from the module can be used as the pull up voltage AP Application Processor controls the module start up and the circuit design is shown in Figure 3 5 Figure 3 5 Circuit for Module Start up Controlled by AP 3 3 1 2 Start up Timing Sequence After powering on the mod...

Page 24: ...al shutdown Hardware Pull down Power_ON OFF pin Only used when a hardware exception occurs and the software control can not be used 3 3 2 1 Software Shutdown The module can be shut down by sending AT CPWROFF command When the module receives the software shutdown command AT CPWROFF the module will start the finalization process the reverse process of initialization and it will be completed after 3s...

Page 25: ...nt unit PMU of the module loses its power and then the module will shut down by hardware Because the PMU will lose its power by pulling down the POWER_ON OFF pin to avoid damaging the module with power on off procedures it s necessary to pull down RESET_N pin for 100ms before pulling down the POWER_ON OFF pin The hardware control timing is shown in Figure 3 8 VBAT POWER_ON OFF VSD2_1V8 Module Stat...

Page 26: ...tor nearby the module In case of PCB layout the RESET_N signal lines should keep away from the RF interference and be protected by GND Also the RESET_N signal lines shall neither near the PCB edge nor route on the surface planes to avoid module from reset caused by ESD 3 4 USB Interface The L811 EB module supports USB 2 0 which is compatible with USB High Speed 480 Mbit s and USB Full Speed 12 Mbi...

Page 27: ...r is supplied The corresponding USB driver shall be installed before the L811 EB module is used on the PC with Win7 system kernel driver should be configured for Android Linux system After the module is inserted into PC with Win7 system the USB driver will map 3 COM ports and 1 NCM ports which are described as follows 2 COM ports can be used to send AT Commands 1 COM port can be used to capture LO...

Page 28: ..._DP signal lines should be parallel and have the equal length the right angle routing should be avoided USB_DN and USB_DP signal lines should be routed on the layer that is next to the ground layer and wrapped with GND on both sides and layers 3 5 USIM Interface The L811 EB module has a built in USIM card interface which supports 1 8V and 3 0V SIM cards 3 5 1 USIM Pins The USIM pins are described ...

Page 29: ...the SIM card is inserted it connects an open circuit between CD and SW pins and drives the SIM1_CD pin high 3 5 2 2 N O SIM card slot The reference circuit design for N O Normally Open SIM card slot is shown in Figure 3 13 Figure 3 13 Reference Circuit for N O SIM Card Slot The principle description for N O SIM card slot is shown in the following When the SIM card is detached it connects an open c...

Page 30: ...then executes the initialization program and finish the network registration after reading the SIM card information When the SIM1_CD is low level the module determines that the SIM card is detached and does not read the SIM card Note By default SIM_CD is active high which can be switched to active low by AT command Please refer to the AT Commands Manual for the AT command 3 5 4 USIM Design The SIM...

Page 31: ...RT port supports AT commands which allows the users to receive and transmit AT commands The definition of the UART port is as follows Pin Pin Name I O Reset Value Pin Description Type A9 UART1_TXD O PU UART1 transmit Data CMOS 1 8V A10 UART1_RXD I PD UART1 receive Data CMOS 1 8V K14 UART1_RTS O PU UART1 Request To Send CMOS 1 8V L14 UART1_CTS I PU UART1 Clear To Send CMOS 1 8V 3 6 2 UART Interface...

Page 32: ... to indicate the software restarting caused by the abnormal operation When the module is working abnormally the software will restart the module and one virtual ACM port will be generated after restarting the module then the CORE_DUMP signal will be changed from low level to high level Module Status CORE_DUMP Signal Normal mode Low level Core Dump High level Note The Core dump indication function ...

Page 33: ..._HOST Signal Ringing SMS or data requests Pull low 1s then Pull high pulse signal Idle Sleep High level WAKEUP_HOST timing is shown in Figure 3 16 Figure 3 16 WAKEUP_HOST Timing 3 7 4 PA_BLANKING While the module works in GSM frequency band the PA_BLANKING pin will output the pulse signals that synchronize with the GSM burst TX timing As the GSM TX may interfere the receiving of the GPS signal AP ...

Page 34: ...AKEUP The L811 EB module provides an additional interrupt port to wake up the module In the case of using USB interface according to the USB protocol the module can be waken up by the USB But in the case of using the serial port the WAKEUP pin needs to be pulled down to wake up the module from sleep mode The definition of the WAKEUP signal is as follows Module status WAKEUP signal Operating mode S...

Page 35: ... human body the BODY_SAR signal will be pulled down by AP As the result the module then lowers down its emission power to its default threshold value reducing RF radiation to the human body The threshold of emission power can be set by the AT Commands The definition for BODY_SAR function is as follows No BODY_SAR signal Function 1 High Floating The module keeps the default emission power 2 Low Low...

Page 36: ...codec via I2S and the codec encodes the audio data to implement the voice call function At this point the module works as the I2S master and the codec works as the I2S slave I2S signal connection is shown in Figure 3 19 Figure 3 19 I2S Signal Connection Description I2S interface can be configured as master or slave mode It supports multiple audio sampling rates 44 1KHz 32KHz 24KHz 16KHz 8KHz It su...

Page 37: ...er for data transmission Note PCM mode timing is relative complicated to adjust and the audio quality will be effected when not fine tuned In contrast to PCM mode I2S mode is easier to adjust hence it is recommended to use I2S mode 3 10 I2C Interface Description The L811 EB module supports one I2C interface which is configured as I2C master by default The I2C master is used for driving external I2...

Page 38: ...Description Type A3 FSYS2_26M O L 26M clock output 1 8V used for external GPS or Audio Codec 1 8V A8 CLK32K O PD 32K clock output 1 8V 1 8V 3 12 ADC Interface The L811 EB module supports ADC detection and the value of the analog voltage can be read by the AT MMAD command The ADC input voltage range is 0 1 2V and the precision reaches 10bit The ADC signal description is as follows Pin Pin Name I O ...

Page 39: ...1930 1990 Band 3 1800MHz LTE FDD GSM 1710 1785 1805 1880 Band 5 850MHz LTE FDD WCDMA GSM 824 849 869 894 Band 7 2600MHz LTE FDD 2500 2570 2620 2690 Band 8 900MHz LTE FDD WCDMA GSM 880 915 925 960 Band 20 800MHz LTE FDD 832 862 791 821 Band 28 750MHz LTE FDD 703 748 758 803 4 2 Transmitting Power The transmitting power for each band of the L811 EB module is as follows Mode Band Tx Power dBm 3GPP Tx...

Page 40: ...ivity dBm 3GPP Rx Sensitivity dBm Typical Note GSM GSM 850 102 108 5 BER 2 43 GSM 900 102 108 5 BER 2 43 DCS 1800 102 108 5 BER 2 43 PCS 1900 102 108 5 BER 2 43 WCDMA Band I 106 7 111 BER 0 1 Band V 104 7 111 BER 0 1 Band VIII 103 7 111 BER 0 1 LTE FDD Band 1 96 3 101 5 10MHz Band width Band 3 93 3 101 5 10MHz Band width Band 5 94 3 102 5 10MHz Band width Band 7 94 3 101 10MHz Band width Band 8 93...

Page 41: ...ents The L811 EB module does not provide RF connector itself so routing RF trace is required for the connection with RF connectors or antenna feed points on the application mainboard It is recommended to use the microstrip line for RF trace with the insertion loss controlled within 0 2dB and impedance controlled at 50Ω It is recommended to reserve a π circuit the parallel inductors should connect ...

Page 42: ...equency range The most proper antenna to adapt the frequencies should be used Bandwidth GSM EDGE GSM850 70 MHz GSM900 80 MHz GSM1800 DCS 170 MHz GSM1900 PCS 140 MHz Bandwidth WCDMA WCDMA band I 2100 250 MHz WCDMA band V 850 70 MHz WCDMA band VIII 900 80 MHz Bandwidth LTE LTE band 1 2100 250 MHz LTE Band 3 1800 170 MHz LTE band 5 850 70 MHz LTE band 7 2600 190 MHz LTE Band 8 900 80 MHz LTE band 20 ...

Page 43: ...re User Manual Page 43 of 47 5 Structure Specification 5 1 Product Appearance The product appearance for L811 EB module is shown in Figure 5 1 Figure 5 1 Module Appearance 5 2 Dimension of Structure The structural dimension of the L811 EB module is shown in Figure 5 2 Figure 5 2 Dimension of Structure Unit mm ...

Page 44: ...rved L811 EB Hardware User Manual Page 44 of 47 5 3 Recommended Design for PCB Bonding Pad Figure5 3 Recommended Design for PCB Bonding Pad Unit mm 5 4 SMT For the design of SMT stencil solder paste and the furnace temperature control please refer to the SMT Application Design Specification ...

Page 45: ...ducts or products shall be stored in the environment with the relative humidity of less than 10 in order to keep products dry 5 5 3 Recommended baking standards Continuous baking time 9 hours Temperature 125 5 Oven Heat convection oven 5 6 Packing The L811 EB module uses the tray sealed vacuum packing combined with the outer packing method using the hard cartoon box so that the storage transportat...

Page 46: ...ll Rights Reserved L811 EB Hardware User Manual Page 46 of 47 5 6 1 Tray Package The L811 EB module uses tray package 20pcs are packed in each tray with 5 trays in each box and 6 boxes in each case Tray packaging process is shown in Figure 5 4 Figure 5 4 Tray Packaging Process ...

Page 47: ...e 47 of 47 5 6 2 Tray size The pallet size is 260 175 6 5mm please refer to Figure 5 5 Unit mm ITEM L W H T A0 B0 DIM 260 0 0 5 175 0 0 5 6 5 0 3 0 5 0 1 35 4 0 3 28 0 0 3 ITEM L1 W1 A1 B1 C D DIM 255 0 0 5 170 0 0 5 235 0 0 3 148 0 0 3 13 0 0 5 12 0 0 5 ITEM E F G J DIM 13 0 0 5 148 0 0 2 80 0 0 2 8 5 0 2 Figure5 5 tray size ...

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