Operating Procedures
:
Patterning
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Patterning
Patterning is the process of moving a beam over the
defined pattern along the specimen surface (while
leaving other areas untouched) with the purpose of:
•
milling
– removing well-defined amounts of
existing material (the pattern is shown in yellow
color)
•
deposition
– adding of well-defined amounts of
new material (the pattern is shown in color
appropriate to the gas selected)
The electron beam is generally used for deposition
while the ion beam for both processes.
The
Patterning
menu and the
Patterning Control
module control the entire process.
C a u t i o n !
When patterning or milling a large volume of material
at higher ion currents, it is recommended to remove any
detector if it is not used. There is a risk of its efficiency decrease by a material deposition.
The system provides additional monitoring possibilities:
•
Simultaneous Patterning and Imaging (SPI)
The SPI provides an electron imaging (in a display different from patterning) during patterning (typically by
ions). It is strongly influenced by secondary electrons generated by the ion beam (SE imaging), so the imaging
quality is not perfect. The higher electron currents (higher spot numbers) and averaging help to improve the
imaging. In case the BSE detector is used this interference is less important (BSE imaging). The system
remembers the brightness and contrast setting separately for SPI or normal imaging.
•
Intermittent Switching between Patterning and Imaging (iSPI)
Unlike the SPI this mode provides an electron imaging (in a display different from patterning) when patterning is
paused, so the electron imaging quality is perfect. This functionality can run automatically according to settings
in the iSPI tab module, Patterning menu and Preferences.
•
Integrated Real Time Monitor (RTM)
The RTM provides an immediate imaging (in the same display with patterning) of the patterning process. The
patterned area is observed and in case of relatively slow scanning, the scan trajectory can be inspected.
RTM is typically used as an end pointing device by observing brightness differences in the detector signal. These
result from contrast differences (when milling through layers of different composition on a stack of multiple
materials or releasing a TEM foil from the EasyLift needle).
RTM can be used with electron or ion beam and with any of the pattern types that are available in the UI. When
starting patterning with the RTM activated, the pattern in the UI will be updated with real time image
information. The patterned area information is updated based on the detector signal which is shown in
synchronization with the beam trajectory.
Because the detector signal is synchronized with the scan of the patterning beam (usually FIB), the other beam
cannot be used to make a live imaging while patterning. As an alternative, it is of course possible to grab
snapshot with the electron beam during FIB patterning while using RTM.
Note
The acquired data are matched to the calculated positions of the corresponding milling points, the pixels shown on the
screen may not therefore directly match to what is happening on the sample surface and some imaging artefacts (due to
milling points and screen pixels mismatch) can occur. To prevent this try to change the field of view.
Summary of Contents for Scios 2
Page 1: ...User Operation Manual Edition 1 Mar 2017 ...
Page 103: ...Alignments I Column Alignments C O N F I D E N T I A L FEI Limited Rights Data 4 19 ...
Page 110: ...Alignments 254 GIS Alignment option C O N F I D E N T I A L FEI Limited Rights Data 4 26 ...
Page 170: ...Operating Procedures Patterning C O N F I D E N T I A L FEI Limited Rights Data 5 60 ...
Page 178: ...Maintenance Refilling Water Bottle C O N F I D E N T I A L FEI Limited Rights Data 6 8 ...
