Application Scheme
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MEC-5007 SERIES
2.3 Opening the Box and Initial Examination
Opening the Box
Please pay attention to the following issues when opening the box:
●
Do not discard the original packing material. Please keep the original packing
material for re-transportation.
●
Please keep the documentation at a safe place. The documentation, which is a part
of the device, is required for initial device debugging.
●
When doing the initial examination, please check whether there are distinct
damages to the device caused during the transport.
●
Please check whether the delivery contains the intact device and all of the
independently ordered accessories. Please contact the customer service when any
unconformity or transportation damages occur.
2.4 Mounting Mode
□
19
″
Rack Mount
■
Desktop
□
Embedded Panel
■
Wall Mount
□
VESA Standard Arm
□
Portable
□
Others___________
2.5 Explanation of Environment of Fully-enclosed Computer
Dissipation methods of fully-enclosed computer: thermal conduction and thermal
radiation methods are deployed to dissipate heat generated by internal components to
the chassis, which in turn passes the heat to the external space by thermal radiation
and convection. The inside of the chassis, the chassis and the space where the
Summary of Contents for MEC-5007 Series
Page 13: ...应用规划 MEC 5007 SERIES 7 图 4 向上通风 ...
Page 16: ...使用说明 10 MEC 5007 SERIES 4 使用说明 4 1 产品外观图 MEC 5007 03 MEC 5007 MEC 5007 02 ...
Page 17: ...使用说明 MEC 5007 SERIES 11 4 2 产品外形及安装尺寸图 MEC 5007 03 单位 mm ...
Page 18: ...使用说明 12 MEC 5007 SERIES MEC 5007 MEC 5007 02 单位 mm ...
Page 36: ...驱动程序安装说明 30 MEC 5007 SERIES 6 驱动程序安装说明 本产品的驱动程序安装及主板详细信息请参考整机配套光盘 在此不做介 绍 ...
Page 39: ......
Page 53: ...Application Scheme MEC 5007 SERIES 9 Figure 4 Upward ventilation ...
Page 59: ...Instructions MEC 5007 SERIES 15 MEC 5007 MEC 5007 02 Unit mm ...
