ESTechnical Reflow Oven Controller Full Upgrade Kit for T962A
40 of 50
Issue
Cause
Solution
When a reflow cycle is
started the
temperature reported
on the display drops
instead of rising
Thermocouple connection is
reversed
Correct the reversed thermocouple
connection
Controller displays
“Thermocouple input
open circuit”
Incorrect connection of the
thermocouple to input A of
the ESTechnical Reflow
Controller, or broken
thermocouple
Disconnect the thermocouple from input A
and measure the resistance of the
thermocouple, it should measure less than 10
ohms. If the thermocouple is open circuit,
replace the thermocouple.
Controller displays
“Temperature following
error during heating”
Thermocouple is incorrectly
placed
Confirm the placement of the thermocouple is
as per the installation instructions and adjust
if necessary
There is no PCB in the oven
drawer
The temperature following error can occur
when the oven drawer is empty and a cycle is
run, test with a PCB below the oven
thermocouple
The
Fan Idle Speed
is set
too high
Ensure the
Fan Idle Speed
is set to the
correct value as suggested in the installation
instructions
The
Ramp up Rate
is set
too high for the PCB(s)
currently in the oven
Reduce the
Ramp up Rate
setting slightly
and test again
ESTechnical Reflow Oven Controller Operating Instructions
Caution
ESTechnical accept no responsibility or liability for personal
injury or damage to property – it is the user's responsibility
to correctly carry out installation and confirm the correct
operation of the oven once installed.
Initial Set Up
Place the Reflow Oven on a hard, level, heat resistant surface
Attach the power cable to the reflow oven and plug in to a power outlet
Ensure none of the grilles on any panel are covered
Overview of Operation
Initial Set Up for new PCB designs
Prepare one or more test PCBs with a thermocouple attached
Load the default profile settings
Perform a test reflow cycle and observe the board temperature
Adjust the cycle settings in small increments and repeat the test cycle (with oven and PCB
starting from near ambient temperature for every test) until the profile meets the needs of the
